Thimble module and method for separating wafer and blue tape using the module

Abstract

The invention discloses a thimble module and a method for using the thimble module for separating wafer from blue film. The thimble module comprises a thimble ring and a thimble arranged in the thimble ring. The thimble ring is provided with a vacuum extraction pathway. The thimble ring is provided with an adsorption plane used for adsorbing a glue film. The adsorption plane is provided with a flow port and a center hole. The flow port is communicated with the vacuum extraction pathway. The invention is characterized in that one end of the thimble is fixed on the thimble ring and the other end of the thimble serves as a thimble point; the adsorption plane at the center hole is a concave-down surface; and the thimble point passes through the center hole. In use, the thimble jacks up the wafer. The blue film is pierced depending upon the relative downward movement of the blue tape instead of the upward movement of the thimble point. In the invention, the thimble is integrated with a thimble seat, so the thimble and the thimble seat move simultaneously. And only a set of drive mechanism is required. Therefore, the structure is more simplified; the size of equipment is reduced, operation frequency increases process time is shortened; and production efficiency gets improved.

Description

technical field [0001] The invention relates to a thimble module, in particular to a thimble module in a solid crystal machine, and a method for using the module to separate a wafer and a blue film. Background technique [0002] After the wafers are diced, each wafer is completely separated from each other and is independently adhered to an adhesive film, which is generally called a blue film. When the machine is picking up the wafer, the mechanical arm uses a vacuum nozzle to suck the wafer from above the blue film, and at the same time, there is an ejector module under the blue film to cooperate, and the ejector force of the ejector is used to push the wafer out of the blue film, and the wafer and The blue film is separated to facilitate the upper suction nozzle to pick up the chip, and then the chip is placed on the die-bonding position after mechanical action. [0003] Such as figure 1 As shown, in the prior art, the thimble module that uses the thimble ring 5 and the ...

AI Technical Summary

Problems solved by technology

The defect of this thimble module is that it needs to be equipped with two sets of lifting drive systems to drive the thimble ring 5 and the thimble 4 respectively, so that the structure of the whole crystal bonding machine is complicated and the volume is too large; and when the wafer and the blue film are separated, the thimble 4 and the thimble The thimble ring 5 moves separately, and there are many moving parts and times, and it is difficult to increase the crystal extraction speed, which limits the improvement of production efficiency

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