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Method for manufacturing conductor frame of LED

A technology of light-emitting diodes and manufacturing methods, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as warping deformation of metal substrates, deformation of insulating shells, stress concentration of metal substrates, etc., to reduce stress concentration Factor, the effect of avoiding warping deformation

Inactive Publication Date: 2008-12-17
I-CHIUN PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, during the manufacturing process, stress concentration will occur on the metal substrate, causing the metal substrate to warp and deform
Such warping deformation may cause deformation of the insulating housing or other structures on the metal substrate, thereby adversely affecting the yield of the LED package

Method used

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  • Method for manufacturing conductor frame of LED
  • Method for manufacturing conductor frame of LED
  • Method for manufacturing conductor frame of LED

Examples

Experimental program
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Embodiment Construction

[0024] see figure 1 and Figure 2A , figure 1 is a flow chart illustrating a method for manufacturing a light emitting diode lead frame according to an embodiment of the present invention, Figure 2A is to draw figure 1 A schematic diagram of the elements described in each step. Such as figure 1 As shown, the manufacturing method of the LED lead frame of the present invention includes steps S11-S15.

[0025] Firstly, in step S11 , a metal substrate 1 is provided. Then in step S12 , punching several wire regions 2 , and each wire region 2 includes at least one pin 20 . In step S13 , the metal substrate 1 is electroplated. Afterwards, in step S14 , an insulating casing 22 is formed on each wire region 2 by injection molding, and then the pins 20 are bent. Finally, in step S15 , several notches 3 are punched around the metal substrate 1 , and each wire area 2 is cut to obtain several LED lead frames. In addition, in the above steps, a step of forming a plurality of posit...

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Abstract

The invention discloses a manufacturing method of a light emitting diode wire holder, which comprises the steps of: (1) providing a metal substrate, and punching a plurality of wire regions, each of which containing at least one pin, on the metal substrate; (2) electroplating the metal substrate; forming an insulating shell on each wire region, and bending the pin; (3) punching a plurality of notches on the periphery of the metal substrate; and (4) cutting each wire region to obtain a plurality of light emitting diode wire holders; wherein each notch is punched to have the shape capable of reducing the stress concentration factor of the metal substrate.

Description

technical field [0001] The invention relates to a manufacturing method of a light-emitting diode lead frame, and in particular to a manufacturing method of a light-emitting diode lead frame that can reduce the stress concentration factor of a metal substrate. Background technique [0002] LED is the abbreviation of light emitting diode (light emitting diode, LED), and is generally used as lighting equipment such as indicator lights and display panels. Light-emitting diodes can not only directly convert electrical energy into light energy with high efficiency, but also have a service life of tens of thousands of hours, and have the advantages of not being broken easily and saving electricity. However, no matter what kind of LED needs to design a reasonable packaging form. The function of the package is to connect the external leads to the electrodes of the LED chip, thereby protecting the LED chip, and according to different designs, it also has the function of improving lum...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L21/48
Inventor 周万顺朱新昌陈立敏李廷玺
Owner I-CHIUN PRECISION IND CO LTD
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