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Novel via structure for improving signal integrity

A signal and signal layer technology, applied in the direction of semiconductor/solid-state device components, high-frequency matchers, printed circuits, etc., can solve the problems of cross-talk interference of transmission signals, impedance discontinuity effect, etc., to avoid mutual interference and reduce impedance. Discontinuity effect, return loss reduction effect

Active Publication Date: 2009-01-14
李察·华德·鲁考斯基 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention provides an innovative perforated structure that can improve signal integrity to solve the problems of crosstalk interference between transmission signals and impedance discontinuity effect in the prior art

Method used

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  • Novel via structure for improving signal integrity
  • Novel via structure for improving signal integrity
  • Novel via structure for improving signal integrity

Examples

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Embodiment Construction

[0056] The structure of four circuit boards is as follows (refer to Figure 1 to Figure 4 ) as an example to illustrate the concept of the present invention, each circuit board has a signal layer, a dielectric layer, a power layer (or ground layer) and a perforated structure, those familiar with this technology will know that the concept of the present invention can also be applied to IC packaging On the through-hole structure of the integrated circuit inside the circuit and the IC or on the through-hole structure of other integrated circuits.

[0057] First, see figure 1 As shown, it is a three-dimensional schematic diagram of the through-hole structure on the current general multilayer circuit substrate 1. There is no power through-hole (or ground through-hole) for connection between the power plane (or ground plane) 7 and 8. Therefore, when the signal through-hole 3 penetrates the power supply When the plane (or ground plane) 7 and 8, the signal will generate electromagnet...

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Abstract

The invention provides a via structure for improving signal integrity and increasing signal quality, applied by any circuit. The embodiment of the invention can be illuminated using four-layer, applied to any multi-layer circuit board; the four-layer circuit can be separated into 3 types of circuit structures: type A (see figure 2): the ground via or power via is plated surrounding the signal via; type B (see figure 4): The ground via or power via is concentric to the signal via; type C (see figure 2 or figure 4): Refer to Type A or Type B. The signal layers are replaced with power layers or ground layers, and the via structure of ground via and power via will become a 'capacitor'.

Description

technical field [0001] The present invention relates to a perforation (via) structure that can reduce crosstalk interference and EMC radiation problems and improve signal quality, and is particularly related to a circuit board, packaged circuit or IC integrated circuit structure, the circuit board, packaged circuit or When the perforation structure of the IC integrated circuit signal line passes through the power plane or the ground plane, a metal surface with the same shape or any shape as the signal perforation is set around a certain distance between the power plane or the ground plane to provide the signal through the perforation structure. There is a voltage reference plane or a current return path, which can reduce the impedance discontinuity effect of the signal when passing through the perforated structure, and reduce the signal return loss (return loss), thereby reducing the crosstalk interference between the perforations and the EMC of the circuit problem and improve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H01L23/498H01L23/552
CPCH05K2201/09809H05K3/4652H01L2924/0002H05K3/429Y10T29/49155H05K1/0222H05K1/115H05K2201/0715H05K1/0251H01L2924/00
Inventor 李察·华德·鲁考斯基许轩儒
Owner 李察·华德·鲁考斯基