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Method and apparatus for improving insufficiency of wafer grinding and thick thickness

A technology for grinding insufficient wafers, applied in grinding devices, grinding/polishing safety devices, grinding machine tools, etc., can solve problems such as excessive wafer thickness, achieve excessive thickness, save manpower and material resources, and increase grinding rate and yield effects

Active Publication Date: 2009-01-21
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In order to solve the above-mentioned problem of excessive wafer thickness due to the dilution of the polishing liquid, a method and device for improving the insufficient thickness of the wafer grinding is proposed, which can effectively improve the problem of excessive wafer thickness

Method used

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  • Method and apparatus for improving insufficiency of wafer grinding and thick thickness
  • Method and apparatus for improving insufficiency of wafer grinding and thick thickness
  • Method and apparatus for improving insufficiency of wafer grinding and thick thickness

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Embodiment Construction

[0016] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0017] figure 2 Is the schematic diagram of the principle of the air control valve. Such as figure 2 As shown, the air-operated valve has three ports, namely port A, port B, and port C. Only when the port A and the port B are simultaneously connected, the air control valve is connected, that is, the port C is connected.

[0018] image 3 Is the schematic diagram of the valve. Such as image 3 As shown, the AND valve has 3 ports, namely port D, port E, and port F. Only when the port D and the port E are simultaneously connected, the connection with the valve is conducted, that is, the port F is connected.

[0019] The first embodiment of the present invention is controlled by an air operated valve.

[0020] Figure 4 It is a schematic diagram of the principle of the present invention adopting an air control valve. As shown in the f...

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PUM

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Abstract

The invention relates to a method for solving the problems of deficiency of wafer grinding and the large thickness of a wafer, and a device thereof. In the invention, two control valves are additionally arranged between a control valve group and a Godzilla system, and thus, the Godzilla system is controlled jointly by a first grinding disk, a second grinding disk and a third grinding disk, that is, the Godzilla system starts to jet water only when the first grinding disk, the second grinding disk and the third grinding disk stop grinding. By using the invention, the problems of the deficiency of wafer grinding and the great thickness of a wafer can be effectively solved. Therefore, the yield is increased, and the labor and material resources are saved.

Description

technical field [0001] The invention relates to the field of semiconductor technology, in particular to a method and a device for improving the insufficient thickness of a wafer after grinding. Background technique [0002] As stated in the application document with the application number 02131650.3, with the development of integrated circuit components towards small and dense, a method of using multiple layers of metal interconnection layers and low dielectric materials to connect the various semiconductor components on the semiconductor chip to each other The multilevel metallization process (Multilevel Metallization Process), which is connected in series to complete the entire stacked loop structure, has been widely used in the VLSI / ULSI process to form more layers of structure on the silicon chip. However, these metal lines and semiconductor elements will cause the surface of the integrated circuit to present a steep topography (Severe Topography), which increases the di...

Claims

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Application Information

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IPC IPC(8): B24B37/04B24B29/00B24B7/22B24B55/00B24B37/34
Inventor 张连伯冯庆安张淑艳汪志宇
Owner SEMICON MFG INT (SHANGHAI) CORP
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