Three-dimensional circuit board and its manufacturing method
A technology of circuit substrate and manufacturing method, applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit and other directions, can solve problems such as low production efficiency, difficulty in forming circuit patterns, and difficulty in forming fine three-dimensional structures.
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no. 1 approach
[0191] Figure 1A It is a partial plan view schematically showing the three-dimensional circuit board in the first embodiment of the present invention, Figure 1B yes Figure 1A Sectional view of line 1B-1B, Figure 1C yes Figure 1A Sectional view of line 1C-1C.
[0192] Such as Figure 1A to Figure 1C As shown, the three-dimensional circuit substrate 10 is, for example, formed on a substrate 20 including polyethylene terephthalate (PET), polyethylene naphthalate, polyimide, glass epoxy resin, silicon, glass, etc. At least one side is provided with a wiring electrode group three-dimensionally formed by a conductive photocurable resin containing a photocurable resin containing conductive fillers such as silver, gold, and silver palladium particles. Here, for easy-to-understand explanation, the Figure 1A Among the wiring electrode groups, the electrode group shown in a strip shape is referred to as the first wiring electrode group 30 , and the electrode group shown in a ...
no. 2 approach
[0229] Figure 8A is a partial sectional view schematically showing a three-dimensional circuit board in a second embodiment of the present invention, Figure 8B It is a partial cross-sectional view schematically showing another example of the three-dimensional circuit board in the second embodiment of the present invention.
[0230] Such as Figure 8A As shown, the three-dimensional circuit substrate 200 in the second embodiment of the present invention has: a first wiring electrode 235 arranged at an arbitrary angle with respect to the horizontal direction of the substrate 220; a first wiring electrode 238 having a different cross-sectional shape; The first wiring electrode group 230 ; and the second wiring electrode group 240 composed of second wiring electrodes 244 arranged obliquely are different from the three-dimensional circuit board 10 of the first embodiment. Here, an arbitrary angle with respect to the horizontal direction means that at least a part of the first w...
no. 3 approach
[0245] Figure 9A is a partial plan view schematically showing a three-dimensional circuit board in a third embodiment of the present invention, Figure 9B yes Figure 9A Sectional view of line 9B-9B, Figure 9C yes Figure 9A Sectional view of line 9C-9C.
[0246] Such as Figure 9A As shown, the three-dimensional circuit board 300, for example, like the first wiring electrodes 310, in the case where one end becomes a free end, the connection electrodes 320 formed in the state of floating in the air during the process of forming the three-dimensional wiring electrode group In the case of these, in order to hold them, the dummy electrodes 330 and 340 that are not connected to other first wiring electrode groups and second wiring electrodes are provided, which is different from the three-dimensional circuit board of other examples of the first embodiment. 60 different.
[0247] That is, if Figure 9B As shown, only the connection electrodes 320 are connected, for example...
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