Nozzle cleaning device and cleaning method

Abstract

The invention discloses a nozzle cleaning device and cleaning method. The nozzle cleaning device comprises a pair of cleaning blocks oppositely disposed by a slit nozzle at middle part; the cleaning block has a length of corresponding to the width direction size of the slit nozzle; a moving part for moving the oppositely disposed pair of cleaning blocks to the contact or separated direction. The invention does not only have cleaning function to the slit nozzle for injecting liquid medicine to the substrate, and also has the function of avoiding the spout of the slit nozzle exposing at sealing component at outside when the slit nozzle is not used for a long time.

Description

technical field [0001] The present invention relates to a nozzle cleaning device and a cleaning method, and more particularly to a nozzle cleaning device and a cleaning method for cleaning a lip of a slit nozzle from which a cleaning liquid is sprayed to prevent clogging or contamination. Background technique [0002] Generally, in the manufacturing process of a semiconductor device or a flat panel display (FPD: flat panel display), in order to make a film that performs a specific function on a substrate (silicon wafer or glass substrate) to be processed, such as an oxide film, a metal film, a semiconductor film, etc. A process of coating the film with a sensitive material that reacts with a light source is performed for patterning a desired shape. [0003] In this way, in order to form a predetermined circuit pattern on the thin film of the substrate to be processed, apply a photosensitive liquid to form a photosensitive film, expose the photosensitive film corresponding to...

AI Technical Summary

Problems solved by technology

[0012] However, the above-mentioned existing nozzle cleaning device, in order to prevent the chemical solution remaining around the nozzle after coating the photosensitive solution from being hardened, only periodically cleans it during the running time of the slit coater, and cannot fundamentally Solve the problem that the slit nozzle in standby mode is exposed outside after finishing the job

Therefore, if the standby time is long, it is obvious that the nozzle of the slit nozzle is exposed to the outside for a long time, so that the chemical solution around the nozzle is hardened, and it is impossible to perform good coating when performing coating operations thereafter.

[0013] Also, if it is a large-area substrate, the size of the slit nozzle should correspond to the substrate, but how big is the size of the slit nozzle? Specifically, if the overall width becomes longer, the movement time of the rubber block used to clean the lip part Can only get longer, resulting in longer overall job times required for cleaning

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