Technique for coating fluorescent powder on LED chip

Abstract

This invention provides a technique of coating fluorescent powder an LED chip, including following steps: (1) fixing an LED chip on a bracket bowl, at the same time, preparing a fluorescent glue with low concentration based on the proportion that the mass ratio of the glue and fluorescent powder of 15:1 to 25:1, and coating to the bowl, wherein the coating depth is 1 / 2-2 / 3 of the bowl depth; (2) roasting and solidifying; (3) preparing a fluorescent glue with normal concentration based on the proportion that the mass ratio of the glue and fluorescent powder of 4:1 to 15:1 and coating to the bowl, roasting; (4) if the coated fluorescent glue in the bowl forms a concave surface after roasting, then repeatedly processing the step (3) until the mixture of the coated glue and the fluorescent powder is level with the edge of the bowel after solidifying and with out the dent. This invention adopts the technical method of multiple coating, which effectively solves influences such as the fluorescent powder deposition and aggregation in the solidifying process after coating the fluorescent powder about one time, improves parameters of the LED using the fluorescent powder, such as the color temperature evenness, color rendering index and color evenness and so on.

Description

technical field [0001] The invention relates to a process for coating fluorescent powder on a light-emitting diode (LED) chip in the technology of converting LED luminous wavelength by adding fluorescent powder to an LED chip, and belongs to the technical field of manufacturing light-emitting diode devices in semiconductor lighting. Background technique [0002] With the emergence of semiconductor light-emitting diodes since the 1970s, people have been unanimously studying the use of phosphors and other materials to change the wavelength of light-emitting diodes (LEDs) for lighting. The production of white light LED or high-efficiency red light LED, etc., can now use phosphor powder to change the wavelength of the light-emitting chip, and can use mixed light of different wavelengths to produce white light or high-efficiency red light LED, so that the wavelength of the LED can be converted, so that The scope of application of LED has been greatly expanded. [0003] However, ...

AI Technical Summary

Problems solved by technology

During the operation process, especially during the curing process, the viscosity of the carrier glue is a dynamic parameter, the specific gravity of the phosphor is greater than that of the carrier glue, which causes precipitation and the accuracy of the dispenser, which causes uneven distribution of the phosphor powder after curing and affects the color temperature of the LED. Uniformity, color rendering index, color uniformity and other characteristics have seriously affected the expansion of LEDs to deeper application fields

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