Passive coupling method between photodevice matrix and optical fiber array and method for making assembly thereof

Abstract

The invention relates to the field of optical coupling encapsulation technology of photodevice matrix in the optical communication technique and discloses a passive coupling method of photodevice matrix and an optical fiber array; the method comprises the following steps: deep etching is carried out on one side of a substrate to form a micro through hole array penetrating the whole substrate; thephotodevice matrix is arranged in a back-off way on the other side of the substrate, and an active area of each tube core of the photodevice matrix vertically aligns with a central axis of each microthrough hole; and the optical fiber array is inserted into the micro through hole array and fixed. The invention simultaneously discloses a device for preparing the optical fiber array and a method thereof. The passive coupling method provided by the invention is characterized by precise position, high coupling efficiency and simple realizing technique.

Description

technical field [0001] The invention relates to the technical field of optical coupling packaging of optoelectronic device arrays in optical communication technology, in particular to a passive coupling method of optoelectronic device arrays and optical fiber arrays and the preparation of components thereof. Specifically, the present invention relates to a surface-emitting or surface-receiving optoelectronic device array, such as a vertical cavity surface-emitting laser (VCSEL) and a surface-receiving photodetector (PIN) array, and a passive coupling method between a multimode fiber array, And the preparation method of the multimode optical fiber array positioning component used for the input or output light coupling of the photoelectric device array. Background technique [0002] With the development of optical communication networks, especially optical fiber access networks and fiber-to-the-home, and the increasing data transmission volume between large-capacity switching ...

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Problems solved by technology

In addition, the anisotropic wet-etched holes on the (100) silicon substrate described in the above-mentioned U.S. patent are square holes in the shape of an inverted pyramid with an inclination angle of 54.7 degrees, so that the size of the square holes formed on the A surface is relatively large.

The typical value mentioned in the patent is 870 microns, while the typical period of the current optoelectronic device array and optical fiber ribbon products is 250 microns, and the large-sized through holes do not meet the requirements for the spacing of optoelectronic device arrays and optical fiber ribbons

[0007] In addition, the above-mentioned US patent does not involve a precise control method for the insertion depth of the optical fiber, and the lack of control of the insertion depth of the optical fiber may lead to two consequences:

[0008] (1) The insertion of the fiber is too shallow, so that the distance between the fiber end face and the VCSEL light-emitting surface is relatively long, which affects the optical coupling efficiency between the VCSEL and the fiber;

[0009] (2) The optical fiber is inserted too deep, so that the end face of the optical fiber pokes the VCSEL light-emitting surface, which will cause damage to the VCSEL laser

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