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Printed circuit board

A technology for printed circuit boards and signal layers, applied in the directions of printed circuits, printed circuits, electrical components, etc., can solve the problems of low wiring density of printed circuit boards, less and less volume, and large wiring space.

Inactive Publication Date: 2011-03-30
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, since the two differential transmission lines of the traditional edge-coupled differential pair are laid on the same layer, for a printed circuit board with more than six layers, at least one middle layer of the printed circuit board needs to be occupied as a reference layer. Occupies a large wiring space, resulting in a low wiring density of the printed circuit board, which does not meet the trend of smaller and smaller information products today

Method used

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  • Printed circuit board
  • Printed circuit board
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Examples

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Embodiment Construction

[0012] Please refer to image 3 , The first preferred embodiment of the printed circuit board of the present invention includes a first reference layer 31, a first signal layer 32, a second signal layer 33, a third signal layer 34, and a fourth signal layer 35 stacked and a second reference layer 36 . The first reference layer 31 and the second reference layer 36 can be ground layers or power layers. A differential pair 37 is arranged on the first signal layer 32 in an edge-coupling manner, and the differential pair 37 includes two differential transmission lines 371 and 372 . A differential pair 38 is arranged on the second signal layer 33 and the third signal layer 34 in a broadside-couple manner. The broadside coupling means that two differential transmission lines in a differential pair are coupled between two adjacent layers of the printed circuit board. The differential pair 38 includes two differential transmission lines 381 and 382 , the differential transmission li...

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PUM

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Abstract

The invention relates to a printed circuit board, comprising a first reference layer, a first signal layer, a second signal layer and a third signal layer which are overlapped; the first differential pair is arranged on the first signal layer in an edge coupling way, and the first differential pair takes the first reference layer as the reference layer; the space between the first signal layer and the second signal layer is larger than that between the first reference layer and the first signal layer; and a second differential pair is arranged in the second signal layer and the third signal layer in a wide-edge coupling way. The printed circuit board properly reduces the space between the first signal layer and the third signal layer and increases the space between the first signal layer and the second signal layer, and differential pairs are arranged on the second signal layer and the third signal layer in a mode of broadside coupling; compared with the prior art, the printed circuitboard reduces the use frequency of the additional reference layer, increases the number of signal layers, and improve the wiring density of the printed circuit board.

Description

technical field [0001] The invention relates to a printed circuit board, in particular to a printed circuit board with high wiring density. Background technique [0002] In today's multilayer printed circuit boards, differential pairs on inner layers are often used to transmit signals. Such as figure 1 As shown, most of the differential pairs in the traditional printed circuit board are laid out in the way of edge-coupled (edge-couple), which means that the two differential transmission lines of the differential pair are coupled to each other in the same signal layer of the printed circuit board. . In order to ensure the quality of signal transmission during actual wiring, a reference layer must be provided above or below the differential pair. For example, the two differential transmission lines 171 and 172 of the differential pair 17 are coupled to each other in the same signal layer 12 of the printed circuit board, and reference layers 11 and 13 are provided above and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/00
CPCH05K1/0245H05K2201/09236H05K2201/0715H05K2201/09672
Inventor 刘建宏许寿国白家南
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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