Silicon chip mark, implementing and reading method thereof

Abstract

The invention discloses a silicon marker, wherein one or a plurality of gratings are formed on the surface of a silicon chip, and the gratings have different spatial cycles which respectively present different mark symbols. The invention further discloses a method for realizing the silicon marker that a plurality of grooves are engraved on the surface of the silicon chip through adopting an engraving device, and the engraved grooves can form one or a plurality of gratings, or a plurality of grooves are formed on the surface of the silicon chip through the photo-etching process and / or the etching process, and the grooves can form one or a plurality of gratings. The invention further discloses a reading method of the silicon marker, which uses laser rays to irradiate one or a plurality of gratings, then identifies the diffraction angle of the diffraction ray of each grating, and finally identifies different mark symbols according to the different diffraction angles. The silicon marker, the realization method and the reading method thereof can realize the automatic identification and tracking for the silicon chip, increase production efficiency, and eliminate failures possibly caused by manual operations.

Description

technical field [0001] The invention relates to marking of silicon wafers in semiconductor manufacturing. Background technique [0002] In semiconductor manufacturing, in order to track silicon wafers, it is necessary to mark the silicon wafers at the beginning of the production line. For commonly used silicon wafer markings, please refer to figure 1 , marking 11 is usually a combination of characters and / or numbers. This silicon chip mark is realized by engraving marks 11 on the surface of the silicon chip 10 . [0003] There are two defects of this kind of silicon chip mark: one is that it needs to manually read the mark to realize the tracking of the silicon chip, which is cumbersome, inefficient and prone to mistakes; Automatic tracking of silicon wafers. Contents of the invention [0004] The technical problem to be solved by the present invention is to provide a silicon wafer mark, which can realize automatic identification of silicon wafers, thereby realizing au...

AI Technical Summary

Problems solved by technology

[0003] There are two defects of this kind of silicon wafer marking: one is that it needs to manually read the marking to realize the tracking of the silicon wafer, which is cumbersome, inefficient and prone to mistakes ; The second is that the automatic recognition of the mark cannot be realized, so that the automatic tracking of the silicon wafer cannot be realized

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