Interposing frame and retaining plate component, and communication equipment

A technology of baffles and frame inserts, which is applied in the field of baffle components, can solve the problems of airflow short circuit, low heat dissipation effect of circuit boards, airflow loss, etc.

Inactive Publication Date: 2011-04-20
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] It can be seen that there will be a short circuit of airflow in the existing subrack, and the airflow may be lost to the outside of the subrack, making the heat dissipation effect on the circuit board lower

Method used

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  • Interposing frame and retaining plate component, and communication equipment
  • Interposing frame and retaining plate component, and communication equipment
  • Interposing frame and retaining plate component, and communication equipment

Examples

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Embodiment Construction

[0040] In order to make the objectives, technical solutions, and advantages of the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and embodiments.

[0041] In the embodiment of the present invention, a baffle plate assembly is provided in the slot of the insert frame, and the baffle plate assembly includes two baffle plates, one of the baffle plates has a rotating shaft, and the rotating shaft is located on one side of the plane where the insertion port is located. It can rotate around its axis of rotation between a preset first position and a second position, wherein if the baffle is in the first position, its projected area in the direction in which the circuit board is inserted into the slot is greater than or equal to the area of ​​the insertion port, If it is in the second position, it will not interfere with the circuit board inserted into the slot; the other baffle in the baffle assembly...

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PUM

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Abstract

The invention provides a plug frame and a baffle component. The implementation manner of the invention is as follows: the baffle component is arranged in a slot; under the condition that a circuit board is inserted in the slot where the baffle component is arranged, the projected area of a first baffle in the direction in which the circuit board is inserted in the slot is larger than or equal to the area of an insertion opening so that the insertion opening of the slot can be covered, thereby preventing the air stream in the plug frame from leaking to the external part; the projected area of a second baffle arranged inside the slot in the direction from an air inlet to an air outlet is larger than or equal to the area of the air inlet, so that the air stream from the air inlet can be prevented from passing through the slot, thereby greatly reducing the air stream flow in the hollow slot, meeting the requirement of the air stream flow of other non-hollow slots, and avoiding air stream short circuit. The baffle component can prevent the air stream from leaking outside the plug frame, greatly reduce the flow passing through the hollow slot, and meet the flow requirements of other non-hollow slots, thereby avoiding air stream short circuit and improving the radiating effect of the circuit board inserted in the plug frame.

Description

Technical field [0001] The present invention relates to heat dissipation protection technology, in particular to a plug-in frame including a baffle assembly and a baffle assembly. Background technique [0002] An insert frame for inserting a circuit board usually includes a plurality of slots, and each slot has an insertion port for inserting a circuit board such as a single board. [0003] Fig. 1 is a schematic diagram of the structure of a conventional subrack. As shown in FIG. 1, the subrack includes four slots 10, and each slot 10 has an insertion port 101 for inserting a single board 11. Among the four slots 10 shown in FIG. 1, a horizontally placed single board 11 is inserted into the top three slots 10, respectively. [0004] On the side of the subrack perpendicular to the plane where the insertion opening 101 of the slot 10 is located, a heat dissipation device 12 is included, and airflow for dissipating heat for the single board 11 is discharged into each slot 10. Wherein...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
Inventor 方雯
Owner HUAWEI TECH CO LTD
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