Workpiece clamping head structure
A workpiece clamp and bonding hole technology, applied in electrical components, metal material coating process, semiconductor/solid-state device manufacturing, etc., can solve the problems of easy peeling, falling, and poor pass rate of glass substrate sputtering process. The effect of increasing the adhesion and improving the pass rate of the process
Inactive Publication Date: 2011-01-26
AU OPTRONICS CORP
View PDF0 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0007] In view of the above problems, the present invention provides a workpiece chuck structure, which is used to improve the glass substrate of the liquid crystal display in the sputtering process. Poor focus, and easy to peel off and drop on the glass substrate, resulting in a poor pass rate of the sputtering process of the glass substrate
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0031] The workpiece chuck structure disclosed by the present invention is used in the sputtering process to clamp a workpiece to be processed and fix it on the supporting seat. The workpiece to be processed is a mobile phone, a notebook computer, a Liquid Crystal Display (LCD), etc. During the production of electronic products, it is desired to form an electronic substrate with a patterned conductive layer, such as a semi-finished display panel. In the following embodiments disclosed by the present invention, the workpiece to be processed is a glass substrate in a liquid crystal display for illustration.
[0032] like figure 2 Shown is a structural schematic diagram of the workpiece chuck structure disclosed in the present invention. The workpiece chuck 10 disclosed in the present invention includes a mounting section 110 , an extending section 120 and a supporting section 130 . The installation section 110 has two coupling holes 111 , and the installation section 110 is c...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| width | aaaaa | aaaaa |
Login to View More
Abstract
The invention relates to a workpiece chuck structure, which is provided with an installing section, an extending section and a bearing section, wherein the extending section is joined with the installing section and bends and extends, the bearing section is joined with the extending section and provided with a bearing surface and a plurality of grooves on the bearing surface. When the workpiece chuck holds a workpiece to be processed to carry out sputtering technology and films are formed respectively on the surface of the workpiece to be processed and the bearing surface of the workpiece chuck, the arrangement of the grooves can ensure the film formed on the bearing surface not to be peeled off and fall on the surface of the workpiece to be processed, so as to improve the qualification rate of the sputtering technology.
Description
technical field [0001] The invention relates to a workpiece chuck, in particular to a workpiece chuck structure for clamping a workpiece to be processed for a sputtering process. Background technique [0002] With the advancement of semiconductor technology and the rapid development of the electronics industry, various electronic products have been widely used in daily life. With the popularity of leisure, the consumer demand for electronic products related to audio-visual audio-visual is increasing day by day. Among them, liquid crystal displays are favored by consumers because of their advantages such as thin size and relatively small space, and they also have a development trend of gradually replacing traditional color picture tube displays. [0003] Generally, in the manufacturing process of liquid crystal displays, there is a processing step of forming a conductive layer on a glass substrate. This step is mostly made by physical vapor deposition (Physical Vapor Deposit...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/34H01L21/687
Inventor 赖育章
Owner AU OPTRONICS CORP