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Method for controlling quality of product by monitoring pressure in IC plastic capsulation mould and equipment thereof

A monitoring control and product quality technology, applied in the direction of total factory control, total factory control, electrical program control, etc., can solve the problems of not being able to monitor the cavity pressure in real time, multiple mold trials, and not being able to accurately determine the injection pressure, etc., to achieve reduction Small impact, improved service life, and reduced internal stress

Inactive Publication Date: 2010-12-01
SHANGHAI UNIV OF ENG SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although this method can also solve problems in production, reduce the number of mold trials and reduce production costs to a certain extent, the method of using software simulation still cannot monitor the pressure in the cavity in real time, so that the injection pressure cannot be accurately determined. Quality control still requires multiple trial molds

Method used

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  • Method for controlling quality of product by monitoring pressure in IC plastic capsulation mould and equipment thereof
  • Method for controlling quality of product by monitoring pressure in IC plastic capsulation mould and equipment thereof
  • Method for controlling quality of product by monitoring pressure in IC plastic capsulation mould and equipment thereof

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Embodiment Construction

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Abstract

The invention relates to the field of semiconductor devices, in particular to a method for controlling product quality by monitoring the internal pressure of an IC plastic package die and equipment thereof. The method includes the procedures of realizing process data acquisition, analysis and optimization and setup function in the stage of die debugging, and realizing process monitoring function in the stage of production. The method is characterized in that the process data in both the die debugging stage and the production stage are actual values of die cavity pressure measured by each die cavity pressure sensor. The invention has the following beneficial effects: the high-precision pressure sensor technology and the computer technology are combined and applied to the IC plastic packaging process so as to directly monitor the pressure change in each plastic package die cavity, and make up for the shortage that the die cavity pressure can only be controlled indirectly by controlling the pressure of a hydraulic system, thereby greatly improving the control precision of the plastic packaging process, reducing the unbalance degree of molten materials pressure among a plurality of die cavities, reducing the impact to gold wires and chips, reducing the internal stress on the product, as well as prolonging the service life and increasing the product qualification rate.

Description

Method and equipment for monitoring and controlling product quality in IC plastic sealing mold [technical field] The invention relates to the packaging of semiconductor devices and integrated circuits, the quality control of injection molded parts and the related fields of mold manufacturing, in particular to a method and equipment for monitoring and controlling product quality in IC plastic packaging molds. [Background technique] The existing IC plastic mold pressure monitoring is indirectly controlled by controlling the hydraulic system pressure of the plastic molding press. Because the pressure of the hydraulic system is transmitted to each cavity of the plastic seal through many paths, in addition to the rigid transmission resistance of the force, there is also the pressure loss of the gating system. There are many uncertain factors in the process from the control point to the cavity, which makes a large difference between the actual cavity pressure parameters and the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05B19/418
CPCY02P90/02
Inventor 曹阳根张恩霞
Owner SHANGHAI UNIV OF ENG SCI