Precious metal tin solder loop thread forming process

Abstract

The invention relates to a technological method for shaping precious metal solder looping yarn, which belongs to the technical field of welding and solder shaping process. The invention aims to provide the technological method for extruding and shaping the solder looping yarn so as to achieve the purposes of saving the solder and reducing the cost. The technological method comprises the followingsteps: the solder looping yarn is rolled and mounted on the external diameter of a steel cylinder pipe through a lathe; the solder looping yarn rolled and mounted is positioned in a temperature control annealing furnace for annealing, insulating and softening the solder looping yarn; the solder looping yarn after annealing and softening is sheered by one circle or by one section; and the sheered looping yarn is positioned in a die for cold stamping. In addition, the annealing temperature controlling level is in the range of 600 to 800 DEG C, and the heat preservation time is in the range of 30 to 120 minutes.

Description

Precious metal solder ring wire forming process technical field The invention relates to the technical field of welding solder forming technology, in particular to a forming process method suitable for precious metal solder ring wire. Background technique Before the present invention was proposed, the materials of solder rings used in welding of electronic products or special materials were mainly silver, silver-copper alloy, gold-copper alloy, copper, etc., but due to the structural shape factor between the weldment and the weldment, it caused Great waste of solder. For example: the traditional process is to use cold strip (also known as thin plate solder) stamping. This method is based on the size of the weldment. The actual utilization rate of the solder only accounts for between 5% and 20% of the strip material. Cold stamping is generally They are all realized by the formwork structure, which requires high precision for the mold. Contents of the invention The obje...

AI Technical Summary

Problems solved by technology

Before the present invention was proposed, the materials of solder rings used in welding of electronic products or special materials were mainly silver, silver-copper alloy, gold-copper alloy, copper, etc., but due to the structural shape factor between the weldment and the weldment, it caused Great waste of solder

For example: the traditional process is to use cold strip (also known as thin plate solder) stamping. This method is based on the size of the weldment. The actual utilization rate of the solder only accounts for between 5% and 20% of the strip material. Cold stamping is generally They are all realized by the formwork structure, which requires high precision for the mold