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Micro electro-mechanical system and manufacturing method therefor

A technology of micro-electro-mechanical systems and manufacturing methods, applied in the field of micro-electro-mechanical systems, can solve problems such as limited noise isolation effect, chip area consumption, unfavorable miniaturization, etc., and achieve the effects of reducing interference, releasing microstructures, and preventing excessive etching

Inactive Publication Date: 2011-11-16
MEMSMART SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the noise generated by different circuits will be conducted through the substrate, causing the circuits to interfere with each other. It is known to use a guard ring or place the noise-prone circuits far away to reduce the interference between the circuits. However, the guard ring system isolates noise by forming a well area (wellarea) on the substrate, and its effect of isolating noise is limited, and the circuit layout that is prone to noise is placed far away, which will cause consumption of chip area. Causes an increase in cost and is not conducive to miniaturization

Method used

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  • Micro electro-mechanical system and manufacturing method therefor
  • Micro electro-mechanical system and manufacturing method therefor
  • Micro electro-mechanical system and manufacturing method therefor

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Embodiment Construction

[0026] figure 1 According to the first embodiment of the present invention, the MEMS 100 includes a structure block 110 having at least one microstructure 102, a circuit block 112 having at least circuits 104 and 106, and a trench 108 located between the circuits 104 and 106 Between the isolation circuits 104 and 106 to avoid mutual interference. In one example, the circuit 106 is a digital circuit or other circuits that are prone to high noise (such as an oscillator), and the noise generated by it is isolated by the trench 108 to avoid passing through the substrate to other circuits in the circuit block 112 (such as an oscillator). circuit 104) to reduce disturbances in the MEMS 100. In another example, the circuit 106 is a circuit that needs to avoid noise interference, and the noise generated by other circuits in the circuit block 112 (such as the circuit 104 ) is isolated through the trench 108 to avoid interference to the circuit 106 .

[0027] Figure 2 to Figure 7 It...

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Abstract

The invention discloses a micro-electromechanical system and the production method thereof. The micro-electromechanical system comprises a micro structure, a circuit, and a ditch positioned between the micro structure and the circuit and used for separating the micro structure from the circuit and preventing over etching generated when the micro structure is released, and the over etching can cause characteristic deterioration of the circuit. The micro-electromechanical system adopts another technical scheme that the system comprises a structural block provided with at least a micro structure, a circuit block at least provided with a first circuit and a second circuit, as well as a ditch positioned between the first circuit and the second circuit and used for separating the first circuit from the second circuit and avoiding the interference between the first circuit and the second circuit. Because the ditch is formed on a base plate, the invention avoids the interference between the circuits and preventing the over etching of the base plate when the micro structure is released.

Description

technical field [0001] The invention relates to a micro-electro-mechanical system, in particular to an interference-avoiding micro-electro-mechanical system and a manufacturing method thereof. Background technique [0002] Micro-Electro-Mechanical Systems (MEMS) is a microfabrication technology that combines surface and bulk, and has been widely used in mechanical filters, accelerators, gyroscopes, optical modulators and radio frequency (RF) passive components. Generally speaking, a micro-electro-mechanical system includes two parts: a circuit and a micro-structure. For example, in the micro-electro-mechanical structure and its manufacturing method disclosed in US Patent No. 5,717,631, when the micro-structure is released, it will damage the circuit or other structures adjacent to the micro-structure. Therefore, the process parameters must be precisely controlled to prevent excessive etching from completely undercutting the underlying substrate adjacent to the microstructure...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81B3/00B81C1/00
Inventor 邱奕翔叶力垦
Owner MEMSMART SEMICON