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Heat radiator

A technology for radiators and heat pipes, applied in indirect heat exchangers, instruments, electric solid devices, etc., can solve the problem of high heat dissipation space requirements for radiators, and achieve the effects of improved heat dissipation, high heat flux density, and small heat source area

Inactive Publication Date: 2009-05-20
苏州天宁换热器有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to provide a radiator through some embodiments, which can overcome the problem of high heat dissipation space required by the radiator in the prior art, so that the radiator can adapt to various installation conditions

Method used

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Experimental program
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Effect test

Embodiment 1

[0030] like figure 1 and figure 2 As shown, it is a three-dimensional structural schematic diagram and a side sectional view of the first embodiment of the heat sink of the present invention, the heat pipe heat sink includes: a base 1, the base 1 has a cavity 10 inside, and the base 1 is provided with four through holes 11 , the through hole 11 communicates with the cavity 10 of the base 1; two back-shaped heat dissipation pipes 2, each nozzle of the heat dissipation pipe 2 is connected with the orifice of a through hole 11 on the base 1, and the heat dissipation pipe The cavity 20 of 2 is connected with the cavity 10 of the base 1, which is used to conduct and dissipate the heat conducted by the base 1; the heat dissipation fins 3 are connected to the outside of the tube wall of the circular heat dissipation pipe 2, and are used to increase the heat dissipation area and strengthen Heat exchange: the evaporating tube 4 and the condensing tube 5 are filled with a liquid or so...

Embodiment 2

[0037] like Figure 8 and Figure 9 As shown, they are the three-dimensional structure schematic diagram and the side sectional view of the radiator embodiment 2 of the present invention, respectively. The heat pipe radiator includes: a base 1 with a cavity 10 inside, and the base 1 is provided with four through holes 11 , the through hole 11 communicates with the cavity 10 of the base 1; two back-shaped heat dissipation pipes 2, each nozzle of the heat dissipation pipe 2 is connected with the orifice of a through hole 11 on the base 1, and the heat dissipation pipe The cavity 20 of 2 is connected with the cavity 10 of the base 1, which is used to conduct and dissipate the heat conducted by the base 1; the heat dissipation fins 3 are connected to the outside of the tube wall of the circular heat dissipation pipe 2, and are used to increase the heat dissipation area and strengthen Heat exchange; the heat collecting seat 6 is used to contact the heat source and absorb the heat ...

Embodiment 3

[0044] like Figure 11 and Figure 12 As shown, they are respectively the three-dimensional structure schematic diagram and the side sectional view of the third embodiment of the radiator of the present invention. Compared with the second embodiment, this embodiment has added a row of transmission pipes 7, and one end of the heat collecting seat 6 is connected to the base 1. The cavity 10 is connected, and the other end is connected to the cavity 10 of the base 1 through the transmission tube 7, so that the working fluid 14 can be transferred to the base 1 through the transmission tube 7 after being heated and evaporated. Other structures and working methods are the same as The second implementation is the same and will not be repeated here.

[0045] In the above three embodiments, because the volume of the working medium increases several times after it changes from liquid or solid to gaseous state, the pressure in the heat dissipation pipe increases, and because the heat di...

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PUM

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Abstract

The invention relates to a radiator, which comprises a base, a radiating pipe, radiating fins and a heat collecting device, wherein the inside of the base is provided with a cavity, the base is also provided with at least two through holes, and the through holes are communicated with a cavity of the base; a pipe opening of the radiating pipe is connected with the through holes on the base, and a cavity inside the radiating pipe is conducted with the cavity of the base and is used for transferring and radiating heat transferred by the base; the radiating fins are connected to the outside of the pipe wall of the radiating pipe, and are used for increasing the radiating area to strengthen heat exchange; and the heat collecting device is used for contacting a heat source to absorb heat of the heat source. The radiator adopts the base and the heat collecting device which are arranged separately, solves the problem that the prior radiator has poor adaptability to shape of mounting space, can be applicable to various radiating conditions of small heat source area, high heat current density as well as long and narrow radiating space of heating elements, and improves the radiating effect of the radiator.

Description

technical field [0001] The invention relates to a radiator, in particular to a radiator suitable for heat dissipation of heating elements. Background technique [0002] With the rapid development of electronics and power technology, especially with the substantial increase in the integration of integrated circuits, the operating speed and output power of various electronic components are increasing significantly, but their heat generation is also increasing. [0003] Taking computers as an example, the integration of CPU chips has increased by nearly 20,000 times in 30 years, and the heat flow generated by them has reached 70W / cm 2 Similarly, the calorific value of the graphics card chip also increases in steps. For CPU chips and graphics card chips of widely used desktop computers, ordinary finned heat sinks are difficult to meet the requirements, and the heat dissipation of electronic components has become one of the important problems restricting the operating speed and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G06F1/20H01L23/34H01L23/427F28D15/02
Inventor 姚福良高俊岭王兆元朱斌
Owner 苏州天宁换热器有限公司