Method for manufacturing planar display
A technology for a flat panel display and a manufacturing method, which is applied to the photoengraving process of the pattern surface, the manufacture of semiconductor/solid-state devices, instruments, etc., can solve the problem of high cost of photomasks, inability to reduce the cost of photomasks, and production costs of liquid crystal displays. Advanced problems, to achieve the effect of reducing the number of photomasks and manufacturing costs
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Embodiment 1
[0043] Figure 2A to Figure 2H A schematic cross-sectional view showing part of the manufacturing process of the display substrate according to the first preferred embodiment of the present invention.
[0044] First please refer to Figure 2A . Wherein, the used display substrate 6 is first fabricated with the source / drain metal layer 64 through the traditional third photomask manufacturing method. The display substrate 6 includes a base material 61 , two metal layers 62 , 64 and an insulating layer 63 . In this embodiment, the substrate 61 is a glass material, the metal layer 62 is a gate metal layer, and the metal layer 64 is a source / drain metal layer. The insulating layer 63 is located between the gate metal layer 62 and the source / drain metal layer 64 , and the gate metal layer 62 , the insulating layer 63 and the source / drain metal layer 64 are overlapped on the substrate 61 .
[0045] exist Figure 2A In the process, a dielectric layer 65 is formed on the display s...
Embodiment 2
[0060] Figure 3A to Figure 3F A schematic cross-sectional view showing part of the manufacturing process of the display substrate according to the second preferred embodiment of the present invention.
[0061] Please also refer to Figure 3A to Figure 3C , where the manufacturing method is the same as that of the previous embodiment Figure 2A to Figure 2C It is the same as shown, only the photoresist layer 66 used here is a positive photoresist, so the range where the first material layer 53 is configured on the halftone photomask 5 is the G region, and the second material layer 53 is not configured. The range of the material layer 52 or the first material layer 53 is the region E, and the rest of the conditions are the same, so it will not be repeated here. through Figure 3A to Figure 3C After the manufacturing method, contact holes 651 and 652 are formed on the display substrate 6 .
[0062] Please also refer to Figure 3D , which shows the continuation Figure 3Cma...
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