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High frequency heating apparatus

A technology of a high-frequency heating device and a cooling device, applied in the field of cooling structure, can solve the problems of increased airflow noise, increased volume of high-voltage transformer 9, increased volume of inverter power supply 7, etc.

Active Publication Date: 2011-03-09
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, since the coil temperature of the high-voltage transformer 9 will also become higher, the wire diameter must be thickened, and the volume of the high-voltage transformer 9 will become larger.
[0010] Due to the above reasons, the volume of the inverter power supply 7 will increase, causing the problem that the volume of the entire product will also increase.
One way to solve this problem is to increase the blowing capacity of the cooling fan 2, but this will cause the problem that the airflow noise will also become larger

Method used

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Examples

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Embodiment 2

[0058] image 3 It is a cross-sectional view of the main structure of the high-frequency heating device in Example 2. In addition, the same symbols as those in Embodiment 1 are the same components, and their descriptions will be omitted.

[0059]Standing walls 61 and 62 are provided around the supporting table 26, and slightly concave coupling portions 63a and 63b are provided in parallel at the ends of the standing walls 61 and 62 . On the other hand, in order to cool the heat sink 37 and the high-voltage transformer 37 on which the switching element 34 and the rectifying element 35 are installed, an air guide member 64 with a slightly H-shaped cross section is provided. The both ends of 64 are provided with slightly convex coupling part 65a, 65b in parallel. Then, the slightly concave joints 63a, 63b provided on the ends of the vertical walls 61 and 62 in parallel and the slightly convex joints provided on both ends of the air guide member 64 with a slightly H-shaped cross...

Embodiment 3

[0066] From Figure 6 to Figure 8 shows the third embodiment of the present invention, Figure 6 shows a partially cut-away cross-sectional view of the high-frequency heating device, Figure 7 The wind speed and wind pressure of the cooling wind generated by the cooling device are shown in , Figure 8 An enlarged oblique view of the air guide components and inverter power supply is shown in .

[0067] Figure 6 Among them, reference numeral 101 denotes a magnetron, 102 denotes a frequency converter power supply, and 103 denotes a cooling device, namely a propeller fan. A cooling fin 105 is installed in the inverter power supply 102 , and a semiconductor switching element 106 and a semiconductor rectifying element 107 are installed on the cooling fin 105 . Moreover, the base 108 on which the frequency converter power supply 102 is installed is integrated with the air guide part 109, and the air guide part 9 is provided with an inclined inner partition wall 109a, thereby for...

Embodiment 4

[0074] Figure 9 It is an enlarged perspective view showing the main structure of the air guide member 109 in the fourth embodiment.

[0075] Figure 9 The difference from the configuration of the first embodiment is that an inner partition 109a is formed by bending a part of the air guide member 109 to narrow the exhaust passage of the cooling air in the exhaust flow direction. In addition, the same components as those in Embodiment 1 are given the same symbols, and their descriptions are omitted.

[0076] First, the air guide member 109 is provided with a partially thinned resin pivot 109d for limiting the bending angle of the inner partition 109a and also for easy bending. When assembling the high-frequency heating device, the operator can easily assemble the inner partition 109a by bending the resin pivot 109d, and at the same time narrow the exhaust passage of the cooling air in the exhaust flow direction. In this way, the mold structure for manufacturing the air guide...

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PUM

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Abstract

The invention provides a high frequency heating apparatus capable of preventing thermal destruction, prolonging the cooking speed, and increasing the cooking speed by efficiently cooling an IGBT and a high-voltage transformer of an inverter power source. A holding stand (26) to hold an inverter comprises a holding unit (39) to hold a power supply unit (25) and an air guide unit (40 to cool electric components of the power supply unit (25). The holding stand covers the power supply unit, and cools mainly a semi-conductor switching element and a high-voltage transformer of the power supply unitin a concentrated manner. Since a semi-conductor (34) and the high-voltage transformer (37) can be sufficiently exposed to fast cooling air, and efficiently cooled, thermal destruction caused by switching losses of the semi-conductor switching element can be prevented. In addition, the temperature rise in the winding of the high-voltage transformer can be suppressed. The high-output time can be prolonged and the cooking speed can be increased thereby.

Description

[0001] This application is a divisional application based on a patent application with application number 200310123707.3, the title of the invention is "high frequency heating device", and the filing date is December 16, 2003. technical field [0002] The present invention relates to high-frequency heating devices such as microwave ovens, and more specifically relates to a structure for efficiently cooling semiconductor switching elements and high-voltage transformers in frequency converter power supplies of high-frequency drive devices. Background technique [0003] Such as Figure 4 and Figure 5 As shown in , in the existing high-frequency heating device, a cooling fan 2 is installed at the rear of the body 1 , and a magnetron 3 is installed in front of the cooling fan 2 . The magnetron 3 is equipped with an air supply pipe 5 for sending cooling air into the heating chamber 4 and an air guide member 6 for guiding the cooling air of the cooling fan 2 to the magnetron 3 . ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05B6/80F24C7/02H05B6/64
Inventor 山口崇任山本孝二
Owner PANASONIC CORP
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