Method and device for wafer optimized scheduling
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
- Publication Date
- 2009-06-17
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Abstract
Description
technical field
[0001] The invention relates to the technical field of process data processing, in particular to a method and device for wafer optimization scheduling in the semiconductor manufacturing industry. Background technique
[0002] The best quality, the lowest manufacturing cost, quick response and flexibility are the key factors for the development of semiconductor manufacturing enterprises.
[0003] The production planning and scheduling system can help semiconductor manufacturing enterprises realize these factors to a certain extent. Scheduling system is an important link to realize the optimization of production management of semiconductor manufacturing enterprises, and an indispensable part of realizing enterprise informatization. The present invention is proposed aiming at realizing wafer scheduling optimally during the wafer processing process in the semiconductor manufacturing industry.
[0004] For example, in the wafer production process, an important l...