Automatic conveying device for turnover type wafer

Abstract

A turnover wafer automatic transmitting device overcomes shortages that the prior art can not do complicated actions in a narrow space in a processing procedure and the like, which comprises a framework, a material loading platform, a wind chest body and an arm mechanism. The technical key includes that a lower arm of the arm mechanism is connected with a catching mechanism through a turnover mechanism, a fixing plate of the catching mechanism is hinged on a turnover base through a turnover shaft, a catching motor of the catching mechanism drives a catching link lever through a turbine worm to further drive a holding jaw to reciprocate along a catching sliding rail, and a locating mechanism on the catching mechanism can be equipped with an adjustable locating block. The turnover wafer automatic transmitting device is reasonable in design, stable in operation when transmitting during the processing procedure, and more flexible and reliable in action, expands application range, can enable a wafer cassette to turn over during the range of 0-90 degrees, can randomly set oblique angles to complete automatic transmitting of wafers in horizontal or perpendicular state, simultaneously also can be adaptable to doing more complicated actions in a narrow space of the process equipment, and can flexibly stop when encountering interference of outsides, thereby achieving transmitting effect of accurate control.

Description

technical field [0001] The invention relates to a wafer conveying device. In particular, a standard mechanical interface (SMIF for short) wafer cassette loading and unloading operation has a reasonable structural design, and the transmission between processes is stable, enabling the flipping of the wafer cassette in the range of 0-90 degrees to be more flexible. Reliable, flip-type wafer automatic transfer device that expands the scope of application. Background technique [0002] Currently, in the semiconductor manufacturing process, wafer handling is critical to IC manufacturing. In order to ensure the quality of wafers when they are transported between different processes and avoid dust particles or other contamination of wafers, more and more transport work uses standard transport containers, that is, standard mechanical interface (SMIF for short) )technology. For example, in US Patents 4,532,970 and 4,534,389, a SMIF system is disclosed. The system reduces the conta...

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Problems solved by technology

[0013] The purpose of the present invention is to provide a flip-type automatic transfer device for wafers. In addition to inheriting the advantages of providing a clean microenvironment from the isolation technology in the SMIF in the prior art, it can also effectively overcome its structural limitations and make it unsuitable. Due to the shortcomings of complex actions in the narrow space of the process, the device has a reasonable structural design, stable transmission and operation between processes, more flexible and reliable actions, and expands the scope of application, enabling it to flip the wafer cassette in the range of 0-90 degrees. And the tilt angle can be set arbitrarily to complete the automatic transfer of wafers in horizontal or vertical state. At the same time, it can adapt to more complex actions in the narrow space of process equipment, and can be flexibly stopped when encountering external interference to achieve precise control of transfer. Effect

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