Welding substrate, electronic package construction applying the welding substrate and package method thereof

Abstract

The invention provides a welding substrate, an electronic package adopting the welding substrate, and a packaging method thereof. The welding substrate includes a plurality of fan-out conductors and a pin pad area, the pin pad area includes a plurality of welding points, at least one fan-out conductor is electrically connected with the pin pad area, and the height of the welding points is larger than that of the fan-out conductors. Through the height difference between the welding points and the fan-out conductors, the reliability of the electronic package adopting the welding substrate can be effectively increased.

Description

technical field [0001] The invention relates to a soldering substrate, an electronic packaging structure using the soldering substrate and a packaging method thereof. Background technique [0002] With the development of electronic science and technology, electronic packaging technology has also made rapid changes. In response to the telecommunications requirements of high heat dissipation and high conduction rate, various electronic packaging technologies have been widely applied to the packaging of semiconductor devices and thin-film transistor substrates, the packaging of semiconductor devices and printed circuit boards, and the packaging of flexible printed circuit boards and rigid printed circuit boards packaging and other fields. [0003] Usually in various electronic packaging manufacturing processes, electronic packaging technologies mainly include: Ball Grid Array Package (BGA Package) technology, Flip-Chip Bonding technology, Chip Scale Package (Chip Scale Package...

AI Technical Summary

Problems solved by technology

[0014] In order to solve the problem of low reliability of soldered substrate packaging in the prior art, it is necessary to provide a soldered substrate with improved packaging reliability

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