Method for producing semi-curing piece and device thereof

Abstract

The invention discloses a method for manufacturing prepregs. The method comprises the process steps of putting an uncoiled glass-fiber-fabric substrate into a glue groove, impregnating the substrate with glue solution, controlling the content of the glue solution through a metering roll, heating and drying the glue solution through an oven. The method is characterized in that the substrate is impregnated with the glue solution and then is sprayed and smeared with glue; the glue solution is sprayed onto the glass-fiber-fabric substrate through high-pressure nozzles; and the spray pressure is between 1 and 10 km / cm<2>. A device for manufacturing prepregs comprises an uncoiling device, a main impregnation device, the metering roll, a heating-drying device and a coiling device, and is characterized in that the device also comprises a spray chamber positioned behind the uncoiling device, and a high-pressure pump, a horizontal shifting mechanism, an upper spray rod and a lower spray rod arranged in parallel, as well as a plurality of high-pressure nozzles which are uniformly distributed on the upper and lower spray rods respectively are arranged in the spray chamber. The method completes the process of spraying and smearing glue through the high-pressure nozzles in the spray chamber, utilizes high pressure to split the glass-fiber-fabric substrate, enables the glue solution to enter spaces among fibers, realizes the complete and uniform infiltration of the glue solution, and reduces the quantity of bubbles.

Description

technical field [0001] The invention relates to a method for manufacturing printed circuit board materials and a device thereof, in particular to a method for manufacturing a prepreg and a device thereof. Background technique [0002] The prepreg is the base material for the production of copper clad board, and the copper clad board is the substrate of the printed circuit board. After the multi-layer prepreg is laminated, copper foil and other metal foils are laminated on one or both sides of the prepreg, and then heated. Pressurized and laminated to form a copper-clad laminate for printed circuit boards. [0003] The existing prepreg production method is as follows: use a resin composition mainly composed of thermosetting resin such as epoxy resin as the glue, dip the glass fiber cloth base material in the glue tank, and accurately control the resin through the metering roller. content, heated and dried in an oven to obtain a prepreg. In this production process, the impre...

AI Technical Summary

Problems solved by technology

However, under the influence of many factors such as the coupling efficiency of the coupling agent, the air permeability of the glass fiber fabric, the degree of fiber opening, the quality of the glass fiber yarn, the molecular weight distribution of the glue, the viscosity of the glue, extrusion force, immersion time, temperature, etc., the obtained quality Stable, well-wetted prepregs often become more difficult

Especially when the glue contains a certain proportion of inorganic fillers (the filler accounts for 0-60% of the weight of the glue, and the diameter is 0-20 μm), the fluidity of the glue becomes poor and the wettability deteriorates.

[0005] In order to improve the above problems of poor impregnation effect and obtain prepregs with good impregnation effect, some manufacturers have to improve the production method and the quality of the substrate: on the one hand, set up one or two prepregs before the main impregnation device (glue tank). The glue process prolongs the dipping time, which greatly reduces the efficiency of the finished product; on the other hand, adding a large amount of expensive organic solvents to the glue solution reduces the viscosity of the glue solution, and the use of excellent quality glass fiber cloth greatly reduces the Speed ​​and other countermeasures, resulting in a significant increase in manufacturing costs

Even if the manufacturing process and substrate are improved from the above two aspects, the dipping effect is still not good, especially for thick prepregs and prepregs containing fillers in the glue. The glue floats on the surface of the substrate and cannot be completely Into the interior of the substrate, resulting in an increase in the formation of air bubbles, resulting in a decrease in the quality of the laminated copper clad laminate

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