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Test method and system

A test method and test program technology, applied in the electronic field, can solve problems such as increased packaging costs, low fault coverage, complex implementation process, etc., to achieve the effects of reducing the number of pins, ensuring product quality, and testing comprehensively

Inactive Publication Date: 2009-06-24
新奇点智能科技集团有限公司
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Problems solved by technology

[0004] However, these two test methods will have certain problems in practical applications. For example, for the first test method, an extremely complicated radio frequency (RF, Radio Frequency) test will be added (SIP usually includes a chip, the test of this chip has very high requirements for test equipment and test environment, etc., and the implementation process is very complicated), it is difficult to realize, and it will increase the number of package pins (pins), thereby increasing the package cost; for the second test method , although the above problems will not exist, but due to the low fault coverage, it is easy to provide bad films to customers

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Embodiment Construction

[0055] Aiming at the problems existing in the prior art, a brand-new testing method is proposed in the present invention. Such as figure 1 as shown, figure 1 It is a flowchart of a method embodiment of the present invention, comprising the following steps:

[0056] Step 101: the device under test (DUT, Device Under Test) acquires a test program from an automatic test equipment (ATE, Automatic Test Equipment), and initializes according to the test program.

[0057] The ATE can send the test program to the port of the DUT in a force pattern in advance; in this way, after the DUT is powered on, the test program can be obtained by reading the corresponding port.

[0058] Step 102: DUT receives a test signal, performs a test according to the test signal, and outputs a test result.

[0059] In this step, the test signal received by the DUT may be from the ATE or from a radio frequency source (RF Source). That is: when the power-on time of the DUT reaches the first predetermined ...

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Abstract

The invention discloses a testing method which comprises the following steps: acquiring the testing procedure from automatic test equipment (ATE) by using a device under test (DUT) and initializing according to the testing procedure; receiving test signals by using the DUT, and testing according the test signals, and outputting test results; and reading the test results by using the ATE and determining whether the DUT conforms to the requirements according to the test results. The invention simultaneously discloses a testing system. By applying the method and the system, the test cost can be reduced, the fault coverage can be improved, and the invention can be implemented easily.

Description

technical field [0001] The invention relates to electronic technology, in particular to a chip testing method and system. Background technique [0002] The characteristics of low cost, small area, high frequency and high speed, and short production cycle make the demand for system-in-package (SIP, System in a Packet) increase day by day, and gradually become a mainstream product packaging form. The SIP mentioned here refers to the integration of multiple functional chips in one package, so as to realize a basically complete function. [0003] In order to ensure product quality, it is necessary to test the encapsulated SIP. At present, the test methods of various manufacturers are basically confidential. The known test methods mainly include the following two types: separate tests for each chip in the SIP and only test connectivity and leakage current. [0004] However, these two test methods will have certain problems in practical applications. For example, for the first t...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
Inventor 张辉王西强苏占峰刘永元张炎杨浴光
Owner 新奇点智能科技集团有限公司
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