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Semiconductor light-emitting device

A light-emitting device and semiconductor technology, applied in the direction of semiconductor devices, electrical solid devices, electrical components, etc., can solve problems such as unexpectable welding strength, and achieve the effect of strong welding strength and low cost

Inactive Publication Date: 2009-07-01
STANLEY ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] However, the actual situation is that the above-mentioned method of providing the gold-plated layer on the end faces 55d, 55e of the electrode 55 and the end faces 56d, 56e of the electrode 56, when the LED lamp 50 is installed on the circuit board, most of the gold-plated layer part Without soldering, the improvement effect of welding strength can hardly be expected

Method used

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  • Semiconductor light-emitting device
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  • Semiconductor light-emitting device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] figure 1 It is a perspective view of Example 1 of the present invention, and is a view seen from the side opposite to the side on which the LED element is mounted and the side on which the circuit board is mounted. The side view type (side view type) LED lamp (hereinafter referred to as LED lamp) 1 of this embodiment is mainly composed of a substrate 2 for mounting LED elements, an LED element (not shown) and a sealing resin 3, and is made of a light-transmitting An LED lamp in which the LED element mounted on the LED element mounting substrate 2 is resin-sealed with a permanent sealing resin 3 . In addition, this Example is an Example in which one LED element was mounted.

[0042] Then, although not shown in the figure, an LED element is placed on one electrode 5 of a pair of electrodes 4, 5 on the LED element mounting substrate 2 via a conductive member to realize electrical conduction between the lower electrode of the LED element and the electrode 5. , and the up...

Embodiment 2

[0061] image 3 It is a perspective view of Example 2 of the present invention, and is a view seen from the side opposite to the side on which the LED element is mounted and the side on which the circuit board is mounted. This embodiment is an LED lamp equipped with 2 LED elements.

[0062] In this embodiment, compared with the above-mentioned embodiment 1, the electrode portion 9b and the electrode portion 9d are respectively located between the electrode portion 4c of the electrode 4 and the electrode portion 5c of the electrode 5 formed on the LED element mounting substrate 2 of the LED lamp 1, And between the electrode portion 4d of the electrode 4 and the electrode portion 5d of the electrode 5 . Moreover, the electrode part 9b and the electrode part 9d are connected in the insulating substrate 6, and the electrode 9 is comprised.

[0063] Generally, the electrode 9 is composed of a three-layer structure of copper foil layer / nickel plating layer / gold plating layer. lay...

Embodiment 3

[0068] Figure 5 It is a perspective view of Example 3 of the present invention, and is a view seen from the side opposite to the side on which the LED element is mounted and the side on which the circuit board is mounted.

[0069] In this embodiment, compared with the above-mentioned embodiment 1, on the end face 4e side near the electrode portion 4c of the electrode 4 formed on the LED element mounting substrate 2 of the LED lamp 1, a cross section penetrating through the electrode portion 4a and the electrode portion 4b is formed. Arc-shaped or elliptical groove portion 10 .

[0070] Similarly, on the side of the end surface 5e near the electrode portion 5c of the electrode 5 formed on the LED element mounting substrate 2 of the LED lamp 1, there is formed an arc-shaped or elliptical groove portion in cross section penetrating the electrode portion 5a and the electrode portion 5b. 11.

[0071] Both the groove part 10 and the groove part 11 are coated with a conductor on t...

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Abstract

The present invention provides a semiconductor light emitter, specifically, the invention provides a side-view type LED lamp which has strong soldering strength to the soldering welding of installed circuit substrate, welding strength increase that can widely adaptive for the bigger dimension and lower dimension and can be manufactured with low cost. An electrode part (4d) and an electrode part (5d) are installed on the substrate (2) for installing the LED component of side-view type LED lamp (1). The electrode part (4d) and the electrode part (5d) extends into an insulation substrate (6) from the electrode (4) and the electrode (5) installed at two ends of insulation substrate (6) in the directions opposing with each other. When the side-view type LED lamp (1) is installed on the circuit substrate (7), the end plane (4e) of electrode part (4d) and the end plane (5e) of electrode part (5d) help to increase the welding strength of soldering welding.

Description

technical field [0001] The present invention relates to a semiconductor light-emitting device, and more specifically, to a semiconductor light-emitting device in which a light irradiation direction is substantially parallel to the surface of the substrate in a mounted state on a circuit board. Background technique [0002] As a semiconductor light-emitting device (hereinafter referred to as an edge-view LED lamp) in which the light irradiation direction is approximately parallel to the substrate surface in the mounted state of the circuit board, there are Figure 8 ~ Figure 10 The semiconductor light-emitting device of the structure shown. Figure 8 It is a view of an edge-view LED luminaire mounted with one LED element (hereinafter referred to as an LED luminaire) viewed from the side of the LED element and the side on which the circuit board is mounted, Figure 9 Viewed from the side opposite to the LED element and the side on which the circuit board is mounted Figure 8 ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/48
CPCH01L2924/0002H01L2924/00
Inventor 小田原正树青木大
Owner STANLEY ELECTRIC CO LTD
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