Method for preparing super-hydrophobic film on copper surface by low-voltage oxidation process

Abstract

The invention discloses a method for preparing a super-hydrophobic thin film on copper surface by using low pressure oxidation process method that can be used for various copper surface needing waterproof adhesive, which belongs to the material surface physical chemistry field. A prior art reaches aim of super-hydrophobic by using organic chemical reagent with low surface energy for decorating, which has high cost, complex technique and has effect to environment. The invention provides a simple low pressure oxidation process that can generate an oxidation copper thin-film with double layers micro-nano structures for reaching super-hydrophobic state, which can remove process of low surface energy organic chemical reagent for decorating, save manufacturing cost, simplify technique and reduce discharge of organic waste.

Description

technical field

[0001] The invention relates to a method for performing superhydrophobic modification on the surface of metal copper by low-pressure oxidation, which can be applied to various copper surfaces requiring waterproof adhesion. It belongs to the field of surface physical chemistry of materials. Background technique

[0002] The technology of making solid surfaces superhydrophobic can be applied in many fields. For example, building walls in our daily life, super-hydrophobic white clean glass on cars, anti-fog mirrors, etc. The research hotspots of hydrophobicity mainly focus on organic chemistry, and the research on inorganic and metal is still relatively small. As a widely used metal material, copper has a demand for surface hydrophobicity in some applications. In recent years, people's research on copper has mainly focused on the modification of organic chemical reagents with low surface energy, which can achieve a super-hydrophobic purpose. [zhi-Guang Guo, ...

Examples

Embodiment 1

[0013] 1. Prepare 2 mol / L KOH and 0.1 mol / L K 2 S 2 o 8 Put the copper sheet into the prepared solution quickly, react at 60°C for 15 minutes, take it out and rinse it with particle-free water. Let dry naturally.

[0014] 2. Put the copper sheet made in 1 into a quartz boat, put it into a vacuum chamber, keep it at 120°C for 1.5h at 1.5Pa, and then cool it down to room temperature.

[0015] Hydrophobicity measurements were performed on the copper surface, with a static contact angle of 151° and a hysteresis angle of 5° with water.

Embodiment 2

[0017] 1. Prepare 3 mol / L KOH and 0.25 mol / L K 2 S 2 o 8 Put the copper sheet into the prepared solution quickly, react at 60°C for 10 minutes, take it out and rinse it with particle-free water. Let dry naturally.

[0018] 2. Put the copper sheet made in 1 into a quartz boat, keep it warm at 120°C for 5 hours under 0.5Pa, and then cool to room temperature.

[0019] The hydrophobicity of the sample surface was measured, and the static contact angle with water was 153°, and the hysteresis angle was 7°.

Embodiment 3

[0021] 1. Prepare 1 mol / L KOH and 0.05 mol / L K 2 S 2 o 8 Put the copper sheet into the prepared solution quickly, react at 60°C for 30 minutes, take it out and rinse it with particle-free water. Let dry naturally.

[0022] 2. Put the copper sheet made in 1 into a quartz boat, keep it warm at 120°C for 3 hours under 20Pa, and then cool to room temperature.

[0023] The hydrophobicity of the sample surface was measured, and the static contact angle with water was 151.5°, and the hysteresis angle was 5°.

technical field

[0001] The invention relates to a method for performing superhydrophobic modification on the surface of metal copper by low-pressure oxidation, which can be applied to various copper surfaces requiring waterproof adhesion. It belongs to the field of surface physical chemistry of materials. Background technique

[0002] The technology of making solid surfaces superhydrophobic can be applied in many fields. For example, building walls in our daily life, super-hydrophobic white clean glass on cars, anti-fog mirrors, etc. The research hotspots of hydrophobicity mainly focus on organic chemistry, and the research on inorganic and metal is still relatively small. As a widely used metal material, copper has a demand for surface hydrophobicity in some applications. In recent years, people's research on copper has mainly focused on the modification of organic chemical reagents with low surface energy, which can achieve a super-hydrophobic purpose. [zhi-Guang Guo, ...

Examples

Embodiment 1

[0013] 1. Prepare 2 mol / L KOH and 0.1 mol / L K 2 S 2 o 8 Put the copper sheet into the prepared solution quickly, react at 60°C for 15 minutes, take it out and rinse it with particle-free water. Let dry naturally.

[0014] 2. Put the copper sheet made in 1 into a quartz boat, put it into a vacuum chamber, keep it at 120°C for 1.5h at 1.5Pa, and then cool it down to room temperature.

[0015] Hydrophobicity measurements were performed on the copper surface, with a static contact angle of 151° and a hysteresis angle of 5° with water.

Embodiment 2

[0017] 1. Prepare 3 mol / L KOH and 0.25 mol / L K 2 S 2 o 8 Put the copper sheet into the prepared solution quickly, react at 60°C for 10 minutes, take it out and rinse it with particle-free water. Let dry naturally.

[0018] 2. Put the copper sheet made in 1 into a quartz boat, keep it warm at 120°C for 5 hours under 0.5Pa, and then cool to room temperature.

[0019] The hydrophobicity of the sample surface was measured, and the static contact angle with water was 153°, and the hysteresis angle was 7°.

Embodiment 3

[0021] 1. Prepare 1 mol / L KOH and 0.05 mol / L K 2 S 2 o 8 Put the copper sheet into the prepared solution quickly, react at 60°C for 30 minutes, take it out and rinse it with particle-free water. Let dry naturally.

[0022] 2. Put the copper sheet made in 1 into a quartz boat, keep it warm at 120°C for 3 hours under 20Pa, and then cool to room temperature.

[0023] The hydrophobicity of the sample surface was measured, and the static contact angle with water was 151.5°, and the hysteresis angle was 5°.