Cu-zn alloy with high strength and excellent bendability

A bending workability, high-strength technology, used in metal layered products, layered products, chemical instruments and methods, etc., can solve the problems of cost reduction and high price, and achieve excellent bending workability, excellent bending workability, The effect of high-strength bending workability

Inactive Publication Date: 2009-07-08
JX NIPPON MINING & METALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Along with this, high-strength copper alloys such as beryllium copper, titanium copper, and Corson alloys have been developed and used. These high-strength copper alloys are expensive compared to conventional copper alloys such as brass, so they are not suitable for cost reduction. demanding areas

Method used

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  • Cu-zn alloy with high strength and excellent bendability
  • Cu-zn alloy with high strength and excellent bendability

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] The copper alloy with the composition shown in Table 1 was melted in a low-frequency induction furnace, and then cast into a mold with a thickness of 180 mm by a vertical continuous casting method to make an ingot. Then hot rolled to 9mm. Thereafter, cold rolling with a cold working ratio of 83% was performed to a thickness of 1.5 mm, followed by annealing, cold rolling, and final annealing. The preparation conditions of each step are shown in Table 1 as Example 1.

[0048] The measurement methods of the relevant characteristic values ​​of the present invention are as follows.

[0049] (a) Tensile strength (TS: MPa) and 0.2% proof stress (YS: MPa) were obtained by taking a No. 13B test piece (JIS Z 2201) parallel to the rolling direction and performing a tensile test (JIS Z 2241).

[0050] (b) The crystal grain size is the number of crystal grains that are completely cut off by a line segment of a specified length by the cutting method (JIS H 0501), and the average va...

Embodiment 2

[0063] In Example 2, the final annealed materials of Example 1 were subjected to final rolling at a processing rate of 0-40%. For example, the embodiment in which the final cold rolling was performed on the material (annealed) of Invention Example 1 is Invention Example 16 (rolled), and the embodiment in which the final cold rolling was performed on the material (annealed) in Comparative Example 9 is comparative Example 24 (finished rolling). The same applies to Inventive Examples 17-23 and Comparative Examples 25-30. The preparation conditions are shown in Table 2, and the results of the effects of Example 2 are shown in Table 2.

[0064] [Table 2]

[0065]

[0066] In Invention Examples 16-23, the relational expression {I(220)+I(111)} / I(200) is within the range satisfying claim 2 or claim 4, so a Cu-Zn alloy having high strength and excellent bending workability can be obtained.

[0067]In Comparative Examples 24 and 26, the average crystal grain size before the fina...

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Abstract

A Cu-Zn copper alloy which is for use in electronic parts such as terminals and connectors and has high strength and excellent bendability. The Cu-Zn alloy having high strength and excellent bendability comprises 20-40 mass% Zn and, as the remainder, Cu and unavoidable impurities, and has such crystal grain characteristics that the average crystal grain diameter (mGS) is 1-4 [mu]m and the standard deviation (sGS) of the crystal grain diameters is 1 / 3 mGS or less. In the alloy, the relationship {I(220)+I(111 / I(200) between X-ray diffraction intensities in an examination of a rolled plane is 2.0-5.0. The Cu-Zn alloy may further contain any one or more of Ni, Si, Fe, Ti, Co, and Sn in an amount of 0.01-0.3 mass%. The alloy preferably has a sulfur content of 30 ppm or lower and has a surface roughness (Ra) of 0.2 [mu]m or lower.

Description

technical field [0001] The present invention relates to a Cu-Zn-based copper alloy having high strength and excellent bending workability used in electronic components such as terminals and connectors. Background technique [0002] In recent years, the thinner / shorter electronic parts have become more prominent than ever before, and accordingly, copper alloy strips for electronic parts are also required to use thinner materials. However, when the material becomes thinner, in order to maintain the contact pressure of the connector, etc., the strength of the material itself must be high. On the other hand, in order to achieve miniaturization of electronic components, in order to exert their functions in a small space, bending is also performed with a small bending radius, and high bending workability is required. Therefore, the material is required to have two contradictory properties of high strength and good bending workability. [0003] Along with this, high-strength copp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/04C22F1/08C22F1/00
CPCB32B15/012C22C9/04
Inventor 江头龙儿
Owner JX NIPPON MINING & METALS CO LTD
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