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LED encapsulation construction and assembling method thereof

A technology of light-emitting diodes and packaging structures, which is applied to electrical components, electric solid-state devices, circuits, etc., and can solve problems such as easy positioning deviation, increased difficulty in bonding light-emitting diodes and metal substrates, and burnt-out of light-emitting diode chips

Inactive Publication Date: 2011-10-26
EVERLIGHT ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when the spot welding temperature is too high, it is easy to cause the LED chip to burn out
And when the pins of the LED are bonded to the metal substrate, positioning deviation is also prone to occur, thus increasing the difficulty of bonding between the LED and the metal substrate

Method used

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  • LED encapsulation construction and assembling method thereof
  • LED encapsulation construction and assembling method thereof
  • LED encapsulation construction and assembling method thereof

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Embodiment Construction

[0025] In order to make the above and other purposes, features and advantages of the present invention more comprehensible, this specification specifically cites preferred embodiments, together with the accompanying drawings, and describes them in detail as follows:

[0026] Please refer to Figure 1A to Figure 1C , which is a three-dimensional schematic view of the LED packaging structure according to the first embodiment of the present invention. The LED packaging structure 100 of this embodiment at least includes a LED 110 and two metal substrates 120 . The light emitting diode 110 is bonded on the metal substrate 120 to form a circuit connection or to dissipate heat.

[0027] like Figure 1A to Figure 1C As shown, the light emitting diode 110 of this embodiment is provided with two electrode pins 111 , which are correspondingly bonded to the metal substrate 120 . Each electrode pin 111 is made of metal material and has a bonding surface 112 for correspondingly bonding on ...

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Abstract

The present invention discloses a light emitting diode encapsulation structure and an assembling method thereof. The assembling method of the light emitting diode encapsulation structure comprises at least: providing a light emitting diode with two electrode pins, wherein each electrode pin is provided with at least one joint surface formed on the outside of each electrode pin; providing two metal substrates with at least a stitching part on each metal substrate; respectively correspondingly connecting the electrode pins of the light emitting diode to the metal substrates; and bending each stitching part so as to make the stitching part correspondingly joint on the joint surface for pressing and fixing each electrode pins on each metal substrate.

Description

technical field [0001] The present invention relates to a light-emitting diode packaging structure and its assembly method, in particular to a light-emitting diode packaging structure and its assembly method for bonding light-emitting diodes on a metal substrate. Background technique [0002] Light Emitting Diode (LED) has low working voltage, low power consumption, high luminous efficiency, short reaction time, pure light color, firm structure, impact resistance, vibration resistance, stable and reliable performance, light weight, small size and Features such as low cost. With the advancement of technology, the brightness level that light-emitting diodes can display is getting higher and higher, and its application fields are becoming more and more extensive, such as: large-area graphic display full-color screen, status indication, sign lighting, signal display, backlight of liquid crystal display source or interior lighting. [0003] Conventional LEDs can be bonded to me...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L23/48H01L25/075H01L21/60
Inventor 许胜佳裴建昌
Owner EVERLIGHT ELECTRONICS
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