Silicon slice mark capturing system and method

Abstract

The invention provides a silicon chip mark capture system and a method thereof. The silicon chip mark capture system comprises a light source and lighting module, an image-forming module, a capture mark, a reference grating, a position collection and movement control module, a photoelectric detection and signal collecting and processing module and an alignment operation and management system. The reference grating is scanned by image-forming of the capture mark to obtain captured signals, the position of the capture mark is identified according to phase position information and amplitude value information of the captured signals, so as to realize extensive capturing of back mark alignment position of an upper piece and ensure that when pre-alignment error of the upper piece exceeds the capturing scope of the silicon chip alignment system, capture of the mark alignment position can be accurately and rapidly realized, thus improving production efficiency, in addition, the modules of the silicon chip mark capture system are used together with the silicon chip alignment system, thus saving installation space and reducing production cost.

Description

Technical field [0001] The invention relates to the field of manufacturing integrated circuits or other micro-devices, in particular to a silicon chip mark capturing system and method. Background technique [0002] In the semiconductor IC integrated circuit manufacturing process, a complete chip usually requires multiple photolithography exposures to be completed. Except for the first photolithography, before exposure, the other levels of photolithography must accurately position the pattern of the level and the pattern left by the previous level of exposure to ensure the correct relative position between the two layers of graphics, that is, the set engraved. The overlay error is usually only allowed within 1 / 3 of the lithography resolution. There are many factors that affect the accuracy of engraving, including the positioning accuracy of the workpiece table, the measurement error of the position measurement system, the alignment error of the mask and the silicon wafer, the inst...

AI Technical Summary

Problems solved by technology

[0007] The object of the present invention is to provide a silicon wafer mark capture system and method for lithography equipment, which can realize large-scale capture of the alignment position of the mark after loading, so as to solve the problem that the pre-alignment error of the wafer exceeds the silicon wafer alignment system. In the case of a limited capture range, the problem that the marker alignment position cannot be accurately captured

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