Optical contraposition apparatus for joint of circuit apparatus and substrates, and system having the same

Abstract

The invention relates to an optical alignment device and a system provided with the same for combining a circuit device with a substrate, which are used for combining the circuit device with the substrate having a height difference with the circuit device through precise alignment. The combining system comprises a bearing device for bearing the substrate, a carrying and moving device for carrying and moving the circuit device, and a set of control device for driving the bearing device and the carrying and moving device to move relatively; and the optical alignment device comprises an optical image acquiring unit which is driven by the control device and is used for acquiring optical images of the circuit device and the substrate synchronously in the direction with the height difference, and an optical path compensating unit which is arranged between the circuit device and the optical image acquiring unit and / or between the substrate and the optical image acquiring unit, and is used for compensating the optical path difference of the height difference of the circuit device and the corresponding substrate. The optical alignment device and the system greatly improve the efficiency of the alignment for the needs of combining the circuit device with the substrate.

Description

technical field [0001] The invention relates to an optical alignment device and a system with the device, in particular to an optical alignment device for bonding a circuit device and a substrate and a system with the device. Background technique [0002] On substrates such as liquid crystal display glass or printed circuit boards, it is often necessary to install integrated circuits or other circuit components. Especially with the complexity of components, the number of pins continues to increase, and the pin density increases accordingly. The efficiency of the bonding process and Accuracy is getting more and more attention, and the industry is devoting great efforts to develop fully automatic machines used in the bonding manufacturing process. Among them, the device responsible for precise positioning of both the circuit device and the substrate to ensure precise alignment during bonding has become an influence on the machine. important factor in performance. [0003] fi...

AI Technical Summary

Problems solved by technology

[0005] That is to say, even if the substrate 10 is made of transparent glass, the fixed-focus industrial camera 14 can directly penetrate the sensing substrate 10, but cannot simultaneously sense the mark X on the substrate 10 and the mark X of the circuit device 12; The retracting and resetting process of the substrate 10 is not only time-consuming, but also creates a chance for mechanical errors. When performing alignment operations successively, the fixed-focus industrial camera 14 also needs to be continuously raised and lowered to change the focus position.

[0006] figure 2 It is a schematic diagram of the operation of the zoom-type industrial camera when the known circuit device is bonded to the substrate for alignment. If the sensing lens is replaced with a zoom-type industrial camera 16, the internal movement of the zoom-type industrial camera 16 can reduce the up and down movement of the camera, but still Have the same problem, unable to sense the mark X on the substrate 10 and the circuit device 12 at the same time

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