Multi-physical field interface multi-scale design method of structure of micro-nano electronic device
An electronic device, multi-physics technology, applied in the field of micro-nano simulation, which can solve the problems of increased computing time and insufficient computing time
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[0022] This embodiment is a simulation of the interface heat transfer characteristics. First, the Green-Lindsay / Lord-Shulman (Green-Lindsay / Lord-Shulman) equation is used to describe the heat transfer coupling mechanism, and then molecular dynamics is used to divide the interface structure into atomic structure integration, and then the finite element is used for Set the thermal load as the boundary condition, and finally program and calculate according to the following steps:
[0023] 1) Solve the finite element equation [K f ]{u f}={Q f}, f stands for unit, K stands for stiffness, u stands for displacement, Q stands for external load, and Q in this embodiment is thermal load.
[0024] 2) Through the finite element shape function { u a e } = [ N ] { u f e } Convert the finite element node temp...
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