Multi-physical field interface multi-scale design method of structure of micro-nano electronic device

Abstract

The invention discloses a multi-physical field interface multi-scale design method of structure of a micro-nano electronic device. A coupling system is firstly described, and the molecular dynamics is used for describing the interface tissue evolution and the material defect characteristics; finite elements are used for providing boundary conditions of thermal cycling, bending and stretching actions to a molecular dynamics model; finally, the mathematical simulation of the characteristics of the interface multi-physical field is carried out. The multi-physical field interface multi-scale design method of the structure of the micro-nano electronic device is formed in view of the characteristics of the multi-physical field interface, especially mask interface of the structure of the micro-nano electronic device for researching a framework of a multi-scale model and also in view of influences of the evolution of micro-interface scale material tissues, the production mechanism of thermal defects and material defects consisting holes, cracks, and the like on the physical characteristics of the micro-structure. Both the calculation efficiency and the scientific accuracy are considered. The macroscopical and microcosmic and nanoscopic simulation of whole performance characteristics of the multi-physical field interface of the structure of the micro-nano electronic device is realized. The hard multi-physical field interface multi-scale design problem of the structure of the micro-nano electronic device is solved.

Description

technical field

[0001] The invention relates to micro-nano simulation, in particular to a multi-scale coupling design method for studying multi-physics field interfaces of electronic device structures. Background technique

[0002] Multilayer structures and multiple interfaces are ubiquitous phenomena in micro-nano electronic devices and device interconnection and packaging. Interface delamination failure has become an important concern in product performance and reliability. Foreign researchers have found through a large number of experiments that the interface is a key part in the manufacture and operation of microsystems, and many damages and defects occur near the interface. However, the research on the interface law of microscopic materials has just started, and the macroscopic theory based on continuum mechanics is no longer applicable. The physical characteristics of the micro-material interface are not only related to the geometry of the microstructure and the distr...

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