Electronic component package

A technology for electronic components and packages, which is applied in the direction of electrical components, electrical solid devices, semiconductor/solid device parts, etc., can solve problems such as crushing of protrusions 914, peeling off of metal plating, scattering of metal particles, etc., and achieves suppression of spattering, The effect of suppressing the generation of spatter

Inactive Publication Date: 2009-09-16
DAISHINKU CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in such a configuration, when the metal base 91 and the metal cap 92 are resistance-welded, the flange 921 of the metal cap 92 comes into contact with the protrusion 914, and the protrusion 914 is crushed when the contact is made, or the metal Plating peeling off
Furthermore, due to the abutment of the protrusion 914 on the flange 921, metal particles may scatter to cause so-called splashing.

Method used

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Embodiment approach

Above-mentioned protrusion 14 can not only be defined by the setting of the apex angle A formed by the equilateral extension line of the protrusion, but can also be defined as Figure 4 As shown, it is defined by the size ratio of the upper side 143 and the lower side 144 of the trapezoidal portion 141 . For example, the width dimension t2 of the upper edge 143 of the trapezoidal portion 141 is set as 25% to 40% of the width dimension t1 of the bottom edge 144, so that the dimension t1 of the bottom edge 144 of the trapezoidal portion 141 is 0.182mm, relative to this dimension t1 By setting the dimension t2 of the upper side 143 of the trapezoidal portion 141 to 0.0455 mm to 0.0728 mm, the same spatter suppression effect as in the above-described embodiment can be expected. That is, by setting the width dimension of the upper side 143 of the trapezoidal portion 141 to 25% to 40% of the width dimension of the bottom side 144, the state in which the welding current during resista...

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Abstract

In an electronic component package, an electronic component element is mounted on a metal base, the electronic component element is covered by covering the metal base with a metal cap, and the electronic component element is hermetically sealed by bonding the metal base with the metal cap by resistance welding. In the electronic component package, a protruding section is arranged at a part to which the metal cap of the metal base abuts, and the protruding leading end of the protruding section is composed of a flat surface. In addition, the protruding section has a cross-section having a shape formed by combining an arc part on an upper side of an isosceles trapezoid.

Description

technical field [0001] The present invention relates to an electronic component package that hermetically seals an electronic component element by joining a metal base and a metal cap by resistance welding in electronic components such as crystal resonators. Background technique [0002] As an electronic component, piezoelectric vibration devices, such as a crystal vibrator, a crystal filter, and a crystal oscillator, are mentioned, for example. In the piezoelectric vibrating device, a metal thin film electrode is formed on the surface of a crystal vibrating plate (piezoelectric vibrating plate) as an electronic component element. In order to protect the metal thin film electrode from external air, the crystal vibrating plate is made of a A package of electronic components formed by resistance welding a metal base and a metal cap) is hermetically sealed. In addition, the crystal resonator described here is widely used as a reference source of frequency and time because of i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/02H03H9/02
CPCH01L2924/0002H01L23/10H01L23/045H03H9/1014H03H9/0528H01L2924/01079H01L2924/00
Inventor 熊谷一彦高野义久中村直敏小笠统嗣中村孝志饭塚实
Owner DAISHINKU CORP
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