Optical device assembly system and method for fixing optical elements

Abstract

The invention discloses an optical device assembly system and a method for fixing optical elements. An optical device comprises the optical elements and a heat sink; a metal layer is plated on at least one surface of each optical element; the assembly system comprises an optical element fixing device, andoptical element fixing device comprises a control module as well as a solder filling device and at least one temperature control bar which are respectively electrically connected with the control module, wherein the solder filling device is used for filling solder between the metal layers of the optical elements and the heat sink, the temperature control bar is used for melting the solder, and the temperature of the temperature control bar can be controlled by the control module. When being used for melting the solder, the temperature control bar can precisely control the temperature of the solder and avoid the insufficient flowability brought by over low solder temperature, thereby ensuring the adjustment precision; in addition, the heat injury possibly brought by the optical elements can be avoided; the real-time temperature adjustment can be realized by adopting an electric control system, and the temperature of the solder can be adjusted according to the element adjusting state which can be controlled to be in a melted or semi-melted state.

Description

technical field [0001] The invention relates to the field of optical devices, in particular to an optical device assembly system and a method for fixing optical components. Background technique [0002] In the current manufacture of optical instruments and equipment, various optical devices including lenses are directly bonded to the heat sink or base by adhesives. Since the bonding gap is small and there may be a certain inclination, traditional The bonding fluidity of the special adhesive is not enough, and it can only be bonded from the outer periphery to the inside, which will cause a cavity in the middle, not completely bonded, thus lacking stability and fixity, and easy to crack under harsh natural conditions. In order to overcome this difficulty, Chinese patent application publication number CN1591059A discloses an optical device assembly device and a method for fixing optical components thereof, including a base and an optical component fixed on the base. The surfac...

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Problems solved by technology

[0003] However, this method of fixing optical components uses a light beam to heat the flux. If the light beam continues to heat the solder during the entire adjustment of the position of the optical component after the flux is melted, the temperature of the solder will be too high, and the optical component may even be damaged; Beam, flux temperature will decrease rapidly, lack of fluidity, directly affect the adjustment of the position of optical components; in addition, because its substrate must be a special transparent material, such as glass, etc., which limits its scope of use

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