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Sensor device and fabrication method for the same

A technology of sensors and devices, which is applied in the field of loudspeaker devices and its manufacturing, can solve the problem of size increase and achieve the effect of reducing the invalid area

Inactive Publication Date: 2009-09-30
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is necessary to secure a space around the opening to form the transducer electrode, which causes the size of the transducer to increase.
In addition, it is necessary to secure a region for forming the substrate electrode on the substrate side, resulting in a dead space.

Method used

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  • Sensor device and fabrication method for the same
  • Sensor device and fabrication method for the same
  • Sensor device and fabrication method for the same

Examples

Experimental program
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Effect test

Embodiment Construction

[0028] One embodiment of the present invention will be described with reference to the accompanying drawings. The sensor device of the present invention has a movable membrane, as long as it has a mechanism that can detect physical changes that occur on the movable membrane. Example to illustrate.

[0029] figure 1 (a) to (c) are speaker devices according to this embodiment, (a) shows a planar structure, (b) shows a cross-sectional structure along line Ib-Ib of (a), and (c) shows Ic of (a) — Sectional structure of line Ic. Such as figure 1 As shown, in the speaker device of the present embodiment, the transducer 12 is held on the substrate 11 via the fixing pad 13 and the adhesive material 14 . Specifically, as the signal processing element 16 , an amplifying element is mounted on the substrate 11 , and the electric signal output from the transducer 12 is amplified by the signal processing element 16 and then output from the speaker device. The converter 12 and the signal ...

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Abstract

The present invention provides a sensor device including: a converter body (21) made of silicon in the shape of a rhombus in plan, the converter body having an opening (21a) in the shape of a hexagon in plan; a substrate (11) for holding the converter body (21); a movable film (22) formed on the opening (21a); a converter electrode (25) formed on the converter body (21); and a substrate electrode (36) formed on the substrate (11), the substrate electrode being electrically connected with the converter electrode (21). The opening (21a) is placed so that four of the six sides of the hexagon extend along the four sides of the rhombus of the converter body. Therefore, the invalid regions generated on the converter and the substrate can be reduced, and high efficiency minisize sensor device can be achieved.

Description

technical field [0001] The invention relates to a sensor device for detecting heat, sound and pressure and a manufacturing method thereof, in particular to a loudspeaker device and a manufacturing method thereof. Background technique [0002] Electronic devices are increasingly required to be miniaturized and lightweight. Sensor devices for detecting heat, sound, pressure, and the like mounted inside electronic equipment are also required to be miniaturized and lightweight. In particular, in portable devices such as mobile phones, microphones, which are one type of sensor devices, are required to be miniaturized and lightweight. [0003] In order to realize miniaturization and weight reduction of sensor devices, transducers for detecting heat, sound, pressure, etc. are mounted on substrates and modularized (for example, refer to Patent Document 1). [0004] Patent Document 1: Japanese Patent Application Laid-Open No. 9-92670 [0005] However, in the above-mentioned conven...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L41/08H01L41/047H01L41/22H04R19/02H04R31/00G01D11/30H10N30/00
Inventor 南尾匡纪富田佳宏
Owner PANASONIC CORP
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