Device and method for producing cold pressure welding compound rivet contacts

A technology of contact manufacturing and cold pressure welding, applied in the direction of manufacturing tools, welding equipment, non-electric welding equipment, etc., can solve the problems of low bonding strength, high cost, unfavorable automatic production and other problems of cladding, and achieve precise control of cladding thickness, Excellent performance-price ratio and high bonding strength

Active Publication Date: 2009-11-25
WENZHOU HONGFENG ELECTRICAL ALLOY
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  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

If it is necessary to add a gold coating or other coatings that meet special performance requirements on the end face of the precious metal, methods such as electroplating, vacuum evaporation, and plasma sputtering deposition must be used. These methods have low coating bonding strength or high cost. Or it is not conducive to large-scale automated production and other shortcomings

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  • Device and method for producing cold pressure welding compound rivet contacts
  • Device and method for producing cold pressure welding compound rivet contacts
  • Device and method for producing cold pressure welding compound rivet contacts

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Embodiment Construction

[0033] The embodiments of the present invention are described in detail below: the present embodiment is implemented under the premise of the technical solution of the present invention, and detailed implementation and specific operation process are provided, but the protection scope of the present invention is not limited to the following implementation example.

[0034] Such as figure 1 with figure 2 As shown, this embodiment includes: a main base 1, a composite strip 2, a die guide hole 3, a wire feeding guide hole 4, a stripping guide hole 5, an upper positioning fixture 6, a lower positioning fixture 7, a strip punch Head 8, copper wire 9, stripping punch 10, material knife 11, material collecting hole 12, upsetting mold base 13, pre-upsetting mold 14 and forming upsetting mold 15, wherein: the main base 1 is horizontal from left to right There are punching guide holes 3, wire material feeding guide holes 4, and stripping guide holes 5. There are upper positioning fixt...

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Abstract

The invention, which belongs to the field of technique for preparing rivet contacts, provides a device and a method for producing cold pressure welding compound rivet contacts. The device includes: a main unit base, a upper positioning clamper, a lower positioning clamper, a strip press head, a material-removing press head, a material knife and a forged piece base. The invention improves the precious metal thread entrance of the existing double-layer compound cold pressure welding rivet driver into a die-stamping structure, and changes the original wire material cutting and feeding mode into a compound strip punching and feeding mode, thereby manufacturing unidirectional multi-layer rivet contacts; preparation of bidirectional multi-layer compound cold pressure welding rivet contacts two identical devices is realized after two identical devices are combined, thereby resolving the difficult problem of production of low-cost single, bidirectional multi-layer compound cold pressure welding rivet contacts coated with gold.

Description

technical field [0001] The invention relates to a production device in the technical field of rivet contact preparation, in particular to a cold pressure welding composite rivet contact manufacturing device and a manufacturing method. Background technique [0002] Rivet contacts are important basic components in electromagnetic relays. According to different uses, rivet contacts are divided into three basic structural forms: integral rivet contacts, double-layer composite rivet contacts and three-layer composite rivet contacts. In the field of weak current applications such as communication, in order to make the contact resistance of the relay low and stable after the relay is closed, gold composite rivet contacts or silver rivet contacts are often gold-plated as a whole. It is too thin, and the non-working surface is also plated with gold. Both methods have the limitations of large amount of precious metal and high product cost. [0003] After searching, it was found that ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01H11/04H01H11/06B23K20/02
Inventor 陈晓陈乐生
Owner WENZHOU HONGFENG ELECTRICAL ALLOY
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