Preparation method of lead-free electronic glass

A technology of lead electronics and glass, which is applied in the field of preparation of lead-free electronic glass, which can solve the problems of operators' health and environmental hazards, the problem of being dissolved in rainwater and soil, and the high price of raw materials, so as to achieve low material cost and high sealing temperature. The effect of low and high volume resistivity

Inactive Publication Date: 2009-12-23
西安创联宏晟电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main problem of existence is that the lead content is high, and the dosage is 50% to 80%. In the production process of glass, it will cause great harm to the health of operators and the environment; into rainwater and soil, causing greater harm to the environment
In order to reduce the harm to the human body and the environment, lead-free sealing glass has been developed at home and abroad. The main systems are: Bi 2 o 3 -B 2 o 3 -SiO 2 、 Bi 2 O3-B 2 O3-ZnO, V 2 o 5 -B 2 o 3 -ZnO, BaO-B 2 o 3 -ZnO, etc. The raw material prices of the first three systems are too high, and the material cost per kilogram is more than 100 yuan. The expansion coefficient of the fourth material system is too large. To reduce the expansion coefficient, the melting point of the material must be increased

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] 1. Formula

[0056] B 2 o 3 60 parts; ZnO 17 parts; CaCO 3 10 copies;

[0057] NaCO 3 8 parts; feldspar 5 parts;

[0058] Accurately weigh according to the above material ratio, the total weight is 1Kg;

[0059] 2. Mixing in the V-shaped mixer for 20 minutes;

[0060] 3. Melting Put the crucible in the crucible furnace, compile the program, raise the temperature to 1300°C, add the material, and add the material for the second time after 20 minutes, until the crucible is full, take it out after another 20 minutes of melting, and slowly pour it into a container filled with water inside;

[0061] 4. Drying After smelting the material, pour off the water, drain the water, put the material into a clean enamel tray, and dry it at 120°C to 150°C for 2 hours;

[0062] 5. Ball mill Put the dried material into the ball mill, the weight of the ball stone is twice that of the material, and ball mill for 3 hours;

[0063] 6. Screening Pass all the ball-milled materials t...

Embodiment 2

[0065] 1. Formula

[0066] B 2 o 3 70 parts; ZnO 10 parts; CaCO 3 5 copies;

[0067] NaCO 3 10 parts; feldspar 5 parts;

[0068] Accurately weigh according to the above material ratio, the total weight is 1Kg;

[0069] 2. Mixing in the V-shaped mixer for 20 minutes;

[0070] 3. Melting Put the crucible in the crucible furnace, compile the program, raise the temperature to 1300°C, add the material, and add the material for the second time after 20 minutes, until the crucible is full, take it out after another 20 minutes of melting, and slowly pour it into a container filled with water inside;

[0071] 4. Drying After smelting the material, pour off the water, drain the water, put the material into a clean enamel tray, and dry it at 120°C to 150°C for 2 hours;

[0072] 5. Ball mill Put the dried material into the ball mill, the weight of the ball stone is twice that of the material, and ball mill for 3 hours;

[0073] 6. Screening All the ball-milled materials pass t...

Embodiment 3

[0075] 1. Formula

[0076] B 2 o 3 80 parts; ZnO 10 parts; CaCO 3 3 copies;

[0077] NaCO 3 5 parts; feldspar 2 parts;

[0078] Accurately weigh according to the above material ratio, the total weight is 1Kg;

[0079] 2. Mixing in the V-shaped mixer for 20 minutes;

[0080] 3. Melting Put the crucible in the crucible furnace, compile the program, raise the temperature to 1300°C, add the material, and add the material for the second time after 20 minutes, until the crucible is full, take it out after another 20 minutes of melting, and slowly pour it into a container filled with water inside;

[0081] 4. Drying After smelting the material, pour off the water, drain the water, put the material into a clean enamel tray, and dry it at 120°C to 150°C for 2 hours;

[0082] 5. Ball mill Put the dried material into the ball mill, the weight of the ball stone is twice that of the material, and ball mill for 3 hours;

[0083] 6. Screening Pass all the ball-milled materials th...

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PUM

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Abstract

The invention relates to a preparation method of lead-free electronic glass. Lead-free electronic glass is developed at home and abroad, and has a main systems comprising Bi2O3-B2O3-SiO2, Bi2O3-B2O3-ZnO, V2O5-B2O3-ZnO, BaO-B2O3-ZnO, and the like. The front three system raw materials have overhigh cost, and the cost of the materials is above 100 yuan per kilogram, and the expansion coefficient of the fourth material system is too large. If the expansion coefficient is wanted to be lowered, a melting point of the materials is needed to rise. The lead-free electronic glass is prepared from the following raw materials by weight portion: 30 to 80 portions of B2O3, 10 to 30 portions of ZnO, 5 to 10 portions of NaCO3, 1 to 10 portions of CaCO3 and 1 to 5 portions of feldspar. The lead-free electronic glass has excellent electrical performance, small dieletric constant, little medium loss as well as high volume resistivity and breakdown strength, and cannot generate damage to a human body during production or generate harmful waste gas, waste water and waste slag.

Description

technical field [0001] The invention belongs to the technical field of electronic materials and relates to a preparation method of lead-free electronic glass, which is mainly used for the outer packaging of electronic components, the bonding of ceramic chips, the sealing of devices and the like. Background technique [0002] In the known technology, the electronic glass widely used in the encapsulation and sealing of electronic components, electric vacuum devices, and semiconductor devices is currently made of PbO-B 2 o 3 -SiO 2 , PbO-ZnO-B 2 o 3 Material system, the material system has good sealing performance, good electrical performance, moderate price, and is currently the mainstream of sealing glass. The main problem is that the lead content is high, and the dosage is 50% to 80%. In the production process of glass, it will cause great harm to the health of operators and the environment; into rainwater and soil, causing greater harm to the environment. In order to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C8/24
Inventor 李宏杰蒋文军卫海民张志旭
Owner 西安创联宏晟电子有限公司
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