Epoxy resin composition, prepreg, laminates and printed wiring boards
A technology of epoxy resin and composition, applied in synthetic resin layered products, printed circuits, printed circuits, etc., to achieve the effects of improving dimensional stability, reducing thermal expansion coefficient, and inhibiting the development of cracks
Active Publication Date: 2009-12-30
PANASONIC CORP
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- Summary
- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
In other words, the present invention solves the problem of providing new and improved epoxy resin compositions for laminates manufactured using epoxy resin compositions as their material
Furthermore, the present invention solves the problem of providing prepregs, laminates and printed wiring boards manufactured using the epoxy resin composition
Method used
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Embodiment
[0079] [1] The present inventors produced laminated boards to be evaluated in the following manufacturing process.
[0080] (1) Components
[0081] Resin varnishes having composition ratios (parts by weight) shown in Table 1 were prepared. The abbreviations of the components in Table 1 are given as follows.
[0082]
[0083] EXA153: EPICLON epoxy resin obtained from DIC Corporation
[0084] YDB400: brominated bisphenol A epoxy resin obtained from Tohto Kasei Co., Ltd.
[0085] EPON1031: epoxy resin obtained from HEXION Specialty Chemicals
[0086] DER593: an epoxy resin obtained from Dow Chemical Company and containing nitrogen and bromine atoms (also containing oxazolidine rings) in its molecule; The molecular average is about 2 epoxy groups.
[0087] N690: cresol-novolac epoxy resin obtained from DIC Corporation and containing no nitrogen and bromine atoms in its molecule; epoxy equivalent of 190-240 g / equivalent, bromine content of 0% by weight, average of 6-4 per mo...
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Abstract
The present invention provides an improved epoxy resin composition enabling better dimensional stability of a laminate by decreasing the coefficient of thermal expansion in its thickness direction of a laminate manufactured using an epoxy resin composition as a material, and by retaining a high level of adhesion in the cured product thereof, enabling better drilling workability of the laminate and suppression of crack development therein during the drilling process, and enabling to decrease impregnation of the plating solution into the laminate associated with those cracks. This epoxy resin composition includes: (A) an epoxy resin; (B) a curing agent composed of phenolic novolac resin curing agent or amine curing agent, (C) an inorganic filler composed of aluminum hydroxide with or without spherical silica; and (D) an elastic component made of minute particles having a core-shell structure with its shell constituted by a resin which is compatible with said epoxy resin (A). The epoxy resin composition exhibits, when cured into an article, a linear coefficient (az) of thermal expansion of 48 or less with respect to a thickness of said article.
Description
technical field [0001] The present invention relates to an epoxy resin composition, a prepreg manufactured using the epoxy resin composition, a laminate manufactured using the prepreg, and a printed wiring board manufactured using the laminate. Background technique [0002] Since thermosetting resins (typically epoxy resins) have excellent adhesive properties, electrical insulation properties, chemical resistance, etc., they are widely used as printed wiring board materials and semiconductor sealing materials. In the process of manufacturing a printed wiring board, a base such as glass cloth or the like is impregnated with a resin varnish containing the above-mentioned thermosetting resin to manufacture a prepreg. After the prepregs are stacked in a predetermined number of layers, metal foils are stacked and aligned, and thermocompression forming is performed to manufacture a laminated board. Then, a circuit is formed by making a conductive pattern in the metal foil on the ...
Claims
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IPC IPC(8): C08G59/62B32B15/092C08J5/24C08K3/22C08K3/36C08L63/00H05K1/03
CPCB32B15/08H05K1/0373H05K2201/068C08G59/50H05K2201/0212B32B27/04C08J2363/00C08J5/24H05K2201/0209C08G59/621B32B5/022B32B5/024B32B5/22B32B5/26B32B15/12B32B15/14B32B15/20B32B29/005B32B2260/021B32B2260/028B32B2260/046B32B2262/0269B32B2262/0276B32B2262/101B32B2307/206B32B2307/30B32B2307/306B32B2307/308B32B2307/50B32B2307/558B32B2307/56B32B2307/714B32B2307/734B32B2457/08Y10T428/31522C08J5/244C08J5/249
Inventor 藤野健太郎泽田知昭西野充修新保孝中村善彦山口真鱼
Owner PANASONIC CORP
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