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Probe station, probe socket, probe card and combination thereof

A probe card and probe technology, used in the field of probe sockets, probe cards and their combinations, and probe stations, can solve problems such as affecting the accuracy of measurement results, the measurement process cannot be carried out smoothly, and the temperature of the test environment rising.

Active Publication Date: 2010-01-20
STAR TECHN INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When testing, the heating device will heat the semiconductor wafer, such as performing a reliability test (reliability test) of the integrated circuit element, and the heat generated by it can be transmitted to the test environment where the probe card is located in the form of heat radiation , or transfer to the test environment where the test board is located via the probe tip of the probe card in a heat conduction manner, causing the temperature of the test environment to rise
Moreover, the rising temperature may cause changes in the physical or chemical properties of the probe card and the objects in the test environment (for example, the thermal expansion and contraction characteristics of the material cause the deformation of the objects), resulting in the failure of the measurement process to proceed smoothly. Or affect the accuracy of the measurement results

Method used

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  • Probe station, probe socket, probe card and combination thereof
  • Probe station, probe socket, probe card and combination thereof
  • Probe station, probe socket, probe card and combination thereof

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Embodiment Construction

[0018] figure 2 The relationship between the probe station of the present invention and the device under test is shown. Similar to the conventional technology, the probe station 20 of the present invention also has two slide rails 16 and multiple non-circular suspension beams 12 arranged in parallel on both sides of the rectangular opening platform. A plurality of probe sockets 24 are erected on the non-circular suspension beam 12, which can finely adjust the relative positions of the probe card and the DUT 21 (such as wafer). Through the horizontal movement on the non-circular suspension beam 12 and the vertical movement of the non-circular suspension beam 12 on the slide rail 16, the probe socket 24 can be roughly adjusted to the position of the DUT 21. any position. Different from the conventional technology, the probe socket 24 communicates with an external testing machine (not shown) through a transmission shaft, and the transmission shaft not only includes signal line...

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Abstract

The invention relates to a probe system, a probe socket, a probe card and a combination thereof. The probe card of the invention comprises a circuit board. The circuit board is provided with a supporting component and radiating holes. The supporting component is used for supporting a plurality of probes to form a needle. The radiating holes are used for cooling the probe card.

Description

technical field [0001] The invention relates to a probe station, a probe socket, a probe card and a combination thereof, in particular to a probe station, a probe socket, a probe card and a combination thereof with a unique heat dissipation function. Background technique [0002] During the manufacturing process of integrated circuit components, probe cards are used to test their electrical characteristics, so as to screen out integrated circuit components that do not meet product specifications. [0003] figure 1 A probe station 11 is disclosed, which includes two sliding rails 16 arranged parallel to two sides of a rectangular opening platform, a plurality of non-circular suspension beams 12 and at least one fine-tuning platform 14 erected on the non-circular suspension beams. Two ends of the non-circular suspension beam 12 are erected on the slide rail 16 through a slide seat 18 respectively. The fine adjustment table 14 is used to carry a probe card, and can adjust the...

Claims

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Application Information

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IPC IPC(8): G01R1/067G01R1/073G01R1/02
Inventor 刘俊良
Owner STAR TECHN INC
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