The invention relates to cutting equipment special for polycrystalline silicon processing and aims to provide a diamond wire crystal ingot squarer. The diamond wire crystal ingot squarer comprises a large bottom frame, a workbench, a workbench horizontal moving motor, a speed reducer, a main screw, a manipulator part, a cutting chamber part, a lifting mechanism, a take-up and payoff part, a tension part and a bottom guide wheel part. According to the diamond wire crystal ingot squarer, a diamond wire saw is adopted for cutting, a cutting mark is small, a cutting face is high in quality, material loss is reduced greatly, and the work environment is improved. According to the diamond wire crystal ingot squarer, a novel rotary mechanism is adopted for decreasing the height of the workbench, and thus the axis distance of a cutting guide wheel is reduced. The wire arch is small, cutter feeding is fast, the cutting efficiency is high, and the cutting dimensional deviation caused by a hard point is avoided. According to the diamond wire crystal ingot squarer, a horizontal moving function is added to a bottom guide wheel, a cutting line is changed into an oblique line from a vertical line during second time of cutter feeding, only a cutting-in opening is cut in the upper portion of a crystal ingot, and thus the uncontrollable size and edge breakage are avoided.