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Direct package mold process for single chip sd flash cards

A molding and contact pad technology, applied in the direction of electrical connection printed components, record carriers used by machines, instruments, etc., can solve problems such as poor electrical contact and high manufacturing cost

Inactive Publication Date: 2010-01-20
SUPER TALENT ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the disadvantage of this overmolding method is that the plastic overflows and overflows on the connector pins, which causes poor electrical contact
Also, it is difficult to use a single molding process to mold multiple PCBAs at the same time, which results in higher manufacturing costs

Method used

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  • Direct package mold process for single chip sd flash cards
  • Direct package mold process for single chip sd flash cards
  • Direct package mold process for single chip sd flash cards

Examples

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Embodiment Construction

[0056] The present invention relates to improvements in methods of making SD (and MMC) devices, and to improved SD devices made by such methods. The following description is presented to enable one skilled in the art to make and use the invention presented in the context of a particular application and its requirements. As used herein, the terms "upper", "upward", "lower", "top", "bottom", "front", "rear", and "downward" are intended to provide Describes the relative location of an object, and is not intended to specify an absolute frame of reference. Various modifications to the preferred embodiment will be apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments. Thus, the invention is not intended to be limited to the particular embodiments shown and described herein but is to be accorded the widest scope consistent with the novel features disclosed herein.

[0057] figure 1 and figure 2It is a perspective and ...

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PUM

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Abstract

A Secure Digital device including a PCBA having passive components mounted on a PCB using surface mount technology (SMT) techniques, and active components (e.g., controller and flash memory) mounted using chip-on-board (COB) techniques. The components are mounted only on one side of the PCB, and then a molded plastic casing is formed over both sides of the PCB such that the components are encased in the plastic, and a thin plastic layer is formed over the PCB surface opposite to the components. The molded plastic casing is formed to include openings that expose metal contacts provided on the PCB, and ribs that separate the openings. In one embodiment the metal contacts are formed on the same side as the thin plastic layer, and in an alternate embodiment the metal contacts are formed on a block that is mounted on the PCB during the SMT process.

Description

technical field [0001] The present invention relates to a portable electronic device, and more particularly to a portable memory card device such as those using the Secure-Digital (SD) specification, and even more particularly to a A manufacturing process for manufacturing SD flash memory cards using single chip package molding technology. Background technique [0002] An electronic device in the form of a card that includes a memory device (such as an Electrically Erasable Programmable Read-Only Memory (EEPROM) or "flash" memory chip) and other semiconductor components, known as a memory card. A typical memory card includes a printed circuit board assembly (PCBA) mounted or molded into a protective housing. A PCBA typically includes a printed circuit substrate (referred to herein simply as a "substrate") formed using known printed circuit board manufacturing techniques with: The memory device and additional components (eg, control circuits, resistors, capacitors, and indu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077H05K1/11
CPCH01L2224/48225H01L25/0657H01L2924/01087H01L2224/48227
Inventor 邱修信马治刚南南金镇圭
Owner SUPER TALENT ELECTRONICS