Liquid processing apparatus, liquid processing method and storage medium
A liquid treatment and cup body technology, which can be used in devices that apply liquid to surfaces, semiconductor/solid-state device manufacturing, coating, etc., and can solve problems such as increasing the total exhaust volume.
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Embodiment Construction
[0059] Hereinafter, according to an embodiment of the present invention, a case where the liquid processing apparatus of the present invention is applied to a coating apparatus for coating a resist liquid on a substrate such as a wafer W will be described as an example. figure 1 2 is the above-mentioned liquid processing device. In this liquid processing device 2, n (n is an integer greater than 3), in this example, 4 liquid processing units 21 to 24 are arranged in the horizontal direction (Y in the figure). Axial direction) in a state of being arranged side by side in a common frame 20. These liquid processing units 21-24 have the same structure, therefore, in figure 2 The liquid processing unit 21 is taken as an example for detailed description.
[0060] figure 2 Middle 3 is a spin chuck as a substrate holding portion for sucking and absorbing the central portion of the back side of the wafer W to keep it horizontal. The spin chuck 3 is connected to a drive mechanism ...
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Description
Claims
Application Information
- IPC
- G03F7/16; G03F7/30; H01L21/00; B05C5/00; B05C11/08; B05C21/00
- CPC
- H01L21/6715; H01L21/67178; H01L21/67051; G03F7/162; G03F7/3021; G02F1/13; G02F1/1339; G02F1/1341
- Inventors
- 长峰秀一; 木下尚文
