Liquid processing apparatus, liquid processing method and storage medium

Abstract

Disclosed is a liquid processing apparatus, a liquid processing method and a storage medium capable of increasing the number of arranged substrate retainers without increasing the total exhaust amountof the liquid processing apparatus. A N-number (N is an integer identical to or greater than three) of cup bodies are inhaled and exhausted in total exhaust amount E through a plurality of separate exhaustion passage each having a first damper, and through a common exhaustion passage connected in common downstream of the separate exhaustion passages. The first dampers are configured such that anexternal air is received from the cup body in a first intake amount of external air E1 for one of the cup bodies where a chemical liquid nozzle is placed at a setting location facing a wafer, and an external air is received from each of the other cup bodies in a second intake amount of external air E2 less than the first amount E1 and the intake amount of external air from both each of the other cup bodies and each of branched passages equals (E-E1) / (n-1).

Description

technical field [0001] The present invention relates to a liquid processing device, a method thereof, and a storage medium for performing liquid processing such as resist application, post-exposure development processing, and the like on semiconductor wafers, LCD (liquid crystal display) substrates, and the like. Background technique [0002] As one of the manufacturing processes of semiconductor devices, LCD substrates, etc., the process of forming a resist pattern on a substrate is carried out through the following series of processes: Forming a resist pattern on a substrate such as a semiconductor wafer (hereinafter referred to as "wafer") The resist film is exposed using a photomask and then developed to obtain a desired pattern. This series of steps is performed by an existing coating and developing device. [0003] Such a coating and developing device includes a liquid processing unit such as a coating unit for coating a resist solution, and an anti-reflection film for...

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Problems solved by technology

However, in this technology, the adjustment of the exhaust volume is also carried out by adjusting the opening and closing degree of the damper, and the downstream side of the damper is always exhausted in accordance with the high exhaust state. case, the result will also lead to an increase in the total displacement

Thus, even with this technology, the above-mentioned problems cannot be solved

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