Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Surface treatment method of printed circuit board and printed circuit board

A printed circuit board and surface treatment technology, applied in the electronic field, can solve problems such as increased product costs and achieve the effect of reducing production costs

Active Publication Date: 2011-12-28
HUAWEI DEVICE CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for components that are not frequently plugged in, since the thickness of the gold layer in the gold finger after electroplating is 0.8-1.3 microns, this treatment method may increase product costs

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Surface treatment method of printed circuit board and printed circuit board
  • Surface treatment method of printed circuit board and printed circuit board
  • Surface treatment method of printed circuit board and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0018] figure 1 It is a flowchart of an embodiment of the surface treatment method of a printed circuit board of the present invention, as figure 1 As shown, this embodiment provides a surface treatment method for a printed circuit board, which may specifically include the following steps:

[0019] In step 101 , the surface treatment of the connector of the printed circuit board is carried out by selecting an electroless nickel-plating treatment method or an ele...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the present invention discloses a surface treatment method of a printed circuit board and the printed circuit board, wherein the surface treatment method of the printed circuit board includes: selecting an electroless nickel plating gold treatment method or The electroplating gold treatment method is to perform surface treatment on the connector of the printed circuit board; the surface treatment of the printed circuit board main body of the printed circuit board is carried out by using the electroless nickel plating gold treatment method and / or the first surface treatment method. The printed circuit board includes a printed circuit board main body and a connector. The surface treatment method of the connector is an electroless nickel-plated gold treatment method or an electroplating gold-plated treatment method selected according to the plugging frequency of the connector. The printed circuit board main body The surface treatment method is the chemical nickel-plating gold treatment method and / or the first surface treatment method. The embodiment of the present invention distinguishes the surface treatment methods of the connectors of the printed circuit boards with different insertion and extraction frequencies, thereby reducing the waste of resources.

Description

technical field [0001] The embodiments of the present invention relate to electronic technology, and in particular to a method for surface treatment of a printed circuit board and the printed circuit board. Background technique [0002] With the rapid development of telecommunications technology, various electronic products and components have emerged, and due to the increasingly fierce market competition, the structures and types of electronic products and components have become more and more diverse and complex. Among them, printed circuit boards (Printed Circuit Board; hereinafter referred to as: PCB) is used as a support for electronic components to provide electrical connections for various parts in electronic components. The interconnection between two PCBs is usually achieved through an edge connector commonly known as a gold finger, that is, inserting a gold finger on one PCB into a suitable slot on another PCB, such as a display card in a computer, The sound card, ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/11H05K3/22
Inventor 景丰华赵龙敬勇
Owner HUAWEI DEVICE CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com