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Front opening wafer cassette with latch structure

A front-opening, wafer cassette technology, which is applied in the field of door latch structures, can solve the problems of increasing the manufacturing cost of the front-opening wafer cassette, the inability of the box body 10 and the door body 20 to be closed, and the inability to be inserted into the box body 10 , etc.

Active Publication Date: 2014-10-29
GUDENG PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method similar to lateral traction tends to generate an offset force in the moving direction of the movable pin 231, which will cause it to fail to be inserted into the socket of the box body 10, so that the box body 10 and the door body 20 cannot be closed. combine
At the same time, it will also increase the manufacturing cost of the front opening wafer box

Method used

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  • Front opening wafer cassette with latch structure
  • Front opening wafer cassette with latch structure
  • Front opening wafer cassette with latch structure

Examples

Experimental program
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Embodiment Construction

[0064] In order to have a more complete and clear description of the technical content used in the present invention, the purpose of the invention and the effects achieved, the details are described below with the accompanying drawings.

[0065] Please refer to Figure 5 , is a schematic diagram of a door of the front-opening wafer cassette of the present invention. Such as Figure 5 As shown, the door body 20 includes a pair of latch structures 60, and each latch structure 60 includes a cam 62 and a pair of sliding devices 64 buckled with both ends of the cam 62, wherein the cam 62 is provided with a pair of guide grooves 621 to The corresponding sliding device 64 is provided for fastening, and each sliding device 64 has a slide groove 642 for the pulley 66 disposed between the outer surface and the inner surface of the door body 20 to be embedded.

[0066] Next, please refer to Figure 6A ,yes Figure 5 The enlarged schematic diagram of the contact end of the cam 62 and ...

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PUM

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Abstract

The invention provides a front-open type disc plate box, comprising a box body, wherein, one side surface of the box body is provided with an opening; the inner part of the box body is provided with plural slots which can accommodate plural disc plates; and a door body is utilized to combine with the opening of the box body to protect the disc plates inside the slots. The invention is characterized in that at least one bolt structure is collocated between the outer surface and the inner surface of the door body. The bolt structure comprises a cam and a pair of sliding devices, wherein, the camis provided with a pair of arc-shaped glide slots which are used for fastening a guide rod on one end of the sliding device; each sliding device is provided with a sliding groove which is used for the embedment of the pulley wheels arranged between the outer surface and the inner surface of the door body, to ensure that forward and backward back and forth movement of the other end of the slidingdevice can be carried out by rotating the cams.

Description

technical field [0001] The present invention relates to a front-opening wafer box, in particular to a latch structure (Latch) configured in the door body of the front-opening wafer box. Background technique [0002] Semiconductor wafers will be transported to different workstations due to the need to go through various processes and to cooperate with process equipment. In order to facilitate the handling of the wafers and avoid contamination from the outside, a sealed container is often used for delivery by automated equipment. Please refer to figure 1 Shown is a schematic diagram of a wafer box of the known technology. This wafer box is a front opening type wafer box (Front Opening Unified Pod, FOUP), which has a box body 10 and a door body 20, and a plurality of slots 11 are provided inside the box body 10 to accommodate a plurality of wafers horizontally. And there is an opening 12 on one side of the box body 10 for carrying out and loading of the wafer, and the door b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/673B65D43/12B65D25/10B65D25/38B65D85/00
Inventor 林志铭邱铭隆
Owner GUDENG PRECISION IND CO LTD