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Method and device for packaging polycrystalline bulk silicon

一种多晶硅、充填装置的技术，应用在包装、包装食品、包装保护等方向，能够解决污染物增加、塑料涂层磨损如此严重、粉碎多晶硅材料污染等问题，达到生产率提高、降低污染、减少颗粒污染的效果

Inactive Publication Date: 2012-03-21
WACKER CHEM GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This can introduce undesirable metal contamination to the inner surface of the bag
Therefore, the unit cannot achieve <50pptw iron levels in the packaged polysilicon
[0012] Second, during bag filling of crushed polysilicon material, contact with the inside of the filling and bag forming tube can lead to contamination of the crushed polysilicon material
[0013] Thirdly, the high drop height of the crushed polysilicon material depending on the design, or the wear caused by the sharp-edged crushed polysilicon material would have such an effect that after packing about 100 tons of material, the plastic coating was worn so badly that Fill and bag forming tube parts must be replaced
[0019] Table 2: Contaminant increase in shredded polysilicon material with manual packaging

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0072] Example 1: Packaging according to the invention

[0073] Twenty batches of 5 kg each of pieces of sizes 5, 4, 3, and 2 were loaded onto a vibratory channel lined with low contamination and passed through freely movable plastic tubes (25 cm in diameter) within 10 seconds. , length 15cm, wall thickness 5mm, and the inclination angle of the vibration channel is 90 degrees) were filled into a free-hanging high-purity PE bag, and the plastic tube was extended into the PE bag (32cm wide, 45cm long, 300μ thick). After filling, the bag is sealed under a vacuum of 500 mbar with a vacuum sealing device with Teflon coated welding wire.

[0074] The filled bag is then manually filled into the outer bag and welded as described above. After being welded and sealed, each bag is introduced into a shipping box. The box is then sealed.

[0075] To determine penetration, the box is first opened and the bag removed, opened and emptied. The emptied bags are each tested as follows:

[0...

Embodiment 2

[0078] Example 2: Traditional Packaging

[0079] In the same way, determine the penetration rate of traditional, non-automated packaging methods. In the case of this method, the two bags are manually inserted one into the other, subsequently manually filled, manually welded and packed into the transport box.

[0080] Table 3 shows the comparison of the method of Example 1 (according to the present invention) and Example 2 (comparative example).

[0081] table 3

[0082] Penetration in %

[0083] Each bag is expressed in mmw

[0084] Table 3 shows that using the packaging method according to the present invention, compared with the traditional, less productive manual method, the penetration rate per bag and the mm of hole 2 In terms of surface area, at least equally good values ​​can be achieved for all silicon chip sizes, and even better values ​​can be achieved for chip sizes 5, 4 and 3. The automatic packaging method according to the invention thus mee...

Embodiment 3

[0085] Example 3: Packaging without removable plastic tube

[0086] Twenty batches of 5kg each, size 5, 4, 3 and 2 pieces were loaded onto low contamination lined vibratory channels and filled within 10 seconds directly into free hanging size 32cm wide , 45cm long, 300μ thick PE double-layer bag. The difference from Example 1 is that no plastic tube is used. After filling, the bag is sealed under vacuum at 500 mbar using a vacuum sealing device with Teflon coated welding wire. The penetration rate and pore surface area of ​​each pocket were determined as described in Example 1.

[0087] Table 4

[0088] Penetration in %

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PUM

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Abstract

The present invention relates to a method for packaging polycrystalline bulk silicon in which polycrystalline bulk silicon is filled into a freely suspended, completely formed bag by means of a filling device and the filled bag is subsequently sealed, characterized in that the bag is made of high-purity plastic having a wall thickness of 10 to 1000 microns.

Description

technical field [0001] The present invention relates to methods and apparatus for packaging comminuted polysilicon material. Background technique [0002] Polycrystalline silicon (polysilicon) is usually deposited from trichlorosilane by the Siemens method and then comminuted, usually with low pollution, for applications in the solar industry and comminuted and crushed for applications in the semiconductor industry. Subsequent parts are cleaned. Depending on the intended application, the pulverized polysilicon material thus obtained may, after packaging, contain the highest metallic elemental impurities described in Table 1. [0003] Table 1: Maximum content of metal impurities [0004] 1.1.1 The numerical unit is pptw [0005] material material Fe Cr Ni Na Zn Al Cu Mo Ti W K co mn Ca Mg V A ＜ 50 ＜ 20 ＜ ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65B29/00B65B25/00B65B55/24B65B39/12
CPCB65B55/24B65B39/12B65B25/00B65B29/00
Inventor H·沃赫纳B·利希滕格尔R·佩赫
Owner WACKER CHEM GMBH