Heat pump-type hot-water supply device

A hot water supply device and heat pump technology, which can be used in residential hot water supply systems, heating methods, water heaters, etc., and can solve problems such as large margins

Active Publication Date: 2010-03-24
DAIKIN IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] However, in the case of low-temperature operation, the specified amount of hot water is not stored, and it is n...

Method used

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  • Heat pump-type hot-water supply device
  • Heat pump-type hot-water supply device
  • Heat pump-type hot-water supply device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0060] first, figure 1 The configuration of the heat pump hot water supply device according to Embodiment 1 of the present invention is shown.

[0061] For example figure 1 As shown, the hot water supply device has a heat source side heat pump unit A and a hot water supply unit B. The heat source side heat pump unit A is composed of a compressor 1 that compresses a refrigerant to obtain a high-temperature and high-pressure refrigerant; The refrigerant condenses to dissipate the heat from the refrigerant; the expansion valve 3 decompresses the high-pressure refrigerant condensed by the heat radiation heat exchanger 2; and the air heat exchanger (evaporator) 4, which The refrigerant decompressed by the expansion valve 3 is evaporated to absorb heat from the air supplied via the fan 5 .

[0062] The hot water supply unit B is composed of: a vertically long water tank (hot water supply tank) 7 for storing hot water supply water; a water supply pipe 8 that supplies water from ...

Embodiment approach 2

[0100] then, Figure 2 to Figure 5 The configuration of the heat pump hot water supply device and the water supply control device thereof according to Embodiment 2, which is configured on the premise of the configuration of Embodiment 1 described above, is shown.

[0101] According to the findings of the inventors, the hardness of well water and tap water on the market and the temperature at which scale adhesion starts, for example, exist Figure 9 In the inverse proportional relationship shown in the graph of , the higher the hardness, the lower the scaling start temperature, and the lower the hardness, the higher the scaling start temperature.

[0102]Therefore, the hardness of the water used by the user is confirmed in advance, and based on the hardness, the set temperature of the hot water used (the set hot water outflow temperature from the endothermic heat exchanger 10 determined by the season) is used as a reference. The maximum allowable hardness of the water actually...

Embodiment approach 3

[0119] then, Figure 6 The configuration of the heat pump hot water supply device according to Embodiment 3, which is configured on the premise of the configuration of Embodiment 1 described above, is shown.

[0120] In Embodiment 3, scale deposition amount monitoring means 17 for monitoring the deposition amount of scale is provided at the hot water outlet portion of the endothermic heat exchanger 10 in the configuration of Embodiment 1 described above. Furthermore, in the third embodiment, a flow rate control unit 16 is provided for depositing scale at the hot water outlet portion of the heat absorption heat exchanger 10 based on the monitoring value (detection value) of the scale deposition amount monitoring unit 17 . In such a way that the amount is below a predetermined value, adjust the solenoid valve V of the second water supply system path 8b 2 to adjust the water inflow to the water quality adjustment unit 13.

[0121] The other structures are the same as those of t...

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PUM

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Abstract

The invention provides a heat pump-type hot-water supply device which includes a heat source-side heat pump unit having a radiation heat exchanger for radiating heat from refrigerant by condensing therefrigerant. The hot-water supply device further includes a hot-water supply unit having a water tank where water is contained, water supply piping for supplying external water into the water tank, water circulation piping communicating with both a bottom section and an upper section of the water tank and circulating water in the bottom section to the upper section of the water tank in a bypassing manner, an absorption heat exchanger located in the middle of the water circulation piping and joined to the radiation heat exchanger of the heat source-side heat pump unit such that the absorptionheat exchanger can absorb heat, and a hot-water supply unit for supplying hot water in the upper section of the water tank to the outside. The water supply piping is branched off into a first water supply route and a second water supply route. The first water supply route supplies, without treatment, the water supplied from the outside into the water tank, and the second water supply route supplies the water from the outside into the water tank after improving the quality of the water by a water quality adjustment unit so that the water does not produce scale. Either or both of the water supply routes are used appropriately depending on the quality of water supplied. As a result, scale deposition is suppressed.

Description

technical field [0001] The present invention relates to a heat pump hot water supply device that heats water in a water tank with a heat pump unit and supplies the heated water in the water tank. Background technique [0002] A heat pump type hot water supply device has been proposed, for example, as an energy-saving hot water supply device (see Patent Document 1 and Patent Document 2). [0003] Such as Figure 8 As shown, in this hot water supply device, the heat source side heat pump unit A is composed of the following parts: a compressor 1, which compresses the refrigerant to obtain a high-temperature and high-pressure refrigerant; a heat radiation heat exchanger (condenser) 2, It condenses the high-temperature and high-pressure refrigerant compressed by the compressor 1 to dissipate heat from the refrigerant; the expansion valve 3 decompresses the high-pressure refrigerant condensed by the heat radiation heat exchanger 2 and an air heat exchanger (evaporator) 4 that abs...

Claims

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Application Information

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IPC IPC(8): F24H1/18F24H1/00C02F1/00C02F5/00
CPCC02F1/66Y02B30/12C02F2209/055F24D17/02C02F5/00C02F1/001F24D19/0092C02F2209/05C02F2209/006C02F2209/40C02F2301/043F24D2200/12Y10T137/7722C02F1/00F24H1/00
Inventor 沼田光春中田春男古井秀治吉田香里
Owner DAIKIN IND LTD
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