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Method for plating wiring board, and wiring board

A wiring substrate and plating technology, applied in electrical components, printed circuit manufacturing, printed circuits, etc., can solve the problems of reducing plating accuracy, plating solution immersion, circuit abnormality, etc., to improve plating accuracy, prevent plating The effect of immersion and prevention of immersion

Active Publication Date: 2012-09-05
NIPPON MEKTRON LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the adhesiveness of the masking tape is low, the infiltration of the plating solution is likely to occur, and the plating accuracy is lowered, which becomes the cause of circuit failure.

Method used

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  • Method for plating wiring board, and wiring board
  • Method for plating wiring board, and wiring board
  • Method for plating wiring board, and wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0119] As an adhesive component, 100 parts by mass of component A-1, 5 parts by mass of component B-1 as a crosslinking agent, and 158 parts by mass of a mixed solvent of methyl ethyl ketone and toluene at a mass ratio of 1:1 were added, stirred and mixed to prepare An adhesive layer-forming coating liquid having a solid content of about 40%.

[0120] Next, the adhesive layer was formed into a coating solution by a conventional method, and was coated on a release sheet having a polyethylene resin layer on one side of a substrate having a polyethylene resin layer on both sides of the paper, and dried to form an adhesive layer with a thickness of 10 μm. A mold release sheet with a thickness of 130 μm on which a mold release layer made of silicone resin is formed has an average centerline roughness (Ra) of 2.6 μm on the surface of the mold release layer, and an uneven surface with an average interval of unevenness of 1.0 mm. In addition, the peeling force of the silicone-based re...

Embodiment 2

[0137] An adhesive layer forming coating liquid was prepared in the same manner as in Example 1, except that the blending amount of component B-1 as a crosslinking agent was 7 parts by mass as the adhesive layer forming coating liquid, and this adhesive layer was used Formation of a coating solution The masking film was produced in the same manner as in Example 1. The 60-degree specular gloss of the surface of the adhesive layer was 11%. The initial peeling force was 0.7N / 25mm, the ball adhesion value was 2 or less, and the peeling force between the release sheet and the adhesive layer was 0.05N / 25mm. Evaluations of other physical properties are shown in Table 1. In addition, a wiring board was produced in the same manner as in Example 1 using this mask film. The physical properties are shown in Table 2 and Table 3.

Embodiment 3

[0139] An adhesive layer forming coating liquid was prepared in the same manner as in Example 1, except that the compounding amount of component B-1 as a crosslinking agent was 10 parts by mass as the adhesive layer forming coating liquid, and the adhesive layer was used Formation of Coating Liquid A mask film was produced in the same manner as in Example 1, and a wiring board was produced using it. The 60-degree specular gloss of the surface of the adhesive layer was 11%. The initial peeling force is 0.1N / 25mm, the ball adhesion value is 2 or less, and the peeling force between the release sheet and the adhesive layer is 0.04N / 25mm. Table 2 and Table 3 show evaluations of physical properties of other mask films and wiring boards.

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Abstract

A method for plating a wiring board is provided. In the method, to selectively plate a plating target area on the wiring board wherein a circuit pattern having an unevenness of 25[mu]m or more is formed on an insulating base material, areas other than the plating target area are masked. For masking, a masking film wherein an adhesive layer and a releasing sheet are laminated in sequence on one surface of a polybutylene terephthalate film is used.After removing the releasing sheet of the masking film, the adhesive layer surface of the masking film is bonded to a prescribed area on the wiring board under the thermoneutral environment, the work is bonded by thermocompression bonding, then, the plating target area is plated. A wiring board using such plating method is also provided. An area not to be plated is not plated by entry of a plating solution, even a wiring board has a large unevenness in a circuit pattern. Furthermore, the masking film has excellent blanking workability, and generation of especially a bur and a hole is prevented.

Description

technical field [0001] The present invention relates to a plating method and a plated wiring substrate during the manufacturing steps of a wiring substrate, and more specifically, to selectively plating a specific portion such as a connection terminal of a flexible printed circuit board or the like. A plating method using a mask film and the resulting wiring board. Background technique [0002] like figure 1 As shown, the wiring board is an arbitrary circuit pattern formed on the insulating substrate 4 by etching the conductor layer of the laminate in which a conductor layer composed of copper foil or the like is laminated as desired via an adhesive layer. 1, 2, etc. substrate. On the surface of the circuit patterns 1 and 2, a plating layer for reducing resistance, protecting the metal surface from oxidation, friction, or decoration is formed as desired. Furthermore, a cover film etc. are affixed as needed to the parts of the circuit pattern 1, 2 which are not connected w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/18C25D5/02
CPCC25D5/022H05K2203/0191H05K3/243C25D5/02H05K3/18
Inventor 根本广次菱沼凉平太田阳介福原邦昭
Owner NIPPON MEKTRON LTD