Processing method of multilayer printed circuit board

Abstract

A method for processing a multilayer printed circuit board, the multilayer printed circuit board has at least two sub-boards, comprising the following steps: in the first step, each sub-board is drilled to form a through hole, a blind hole and / or an insertion hole Wire holes, and conduct copper sinking and electroplating on the through holes, blind holes and / or insertion holes, so that the sub-boards are laminated to form a multi-layer core board body; the second step is to bond metal on the bottom surface of the multi-layer core board body Copper sheet, so that the metal copper sheet covers the opening of the through hole, blind hole and / or wire insertion hole on the bottom surface of the multilayer core board body; the third step is to carry out copper sinking, electroplating and graphic production on the multilayer core board body, and for multiple The metal copper sheet on the bottom surface of the multilayer core board body is etched; the fourth step is to mill a step groove on the top surface of the multilayer core board body, and remove the bottom surface of the printed circuit board at the through hole, blind hole and / or insertion hole. The metal copper sheet forms a multilayer printed circuit board; during the copper sinking or / and electroplating process of the present invention, the electroplating solution will not corrode the hole wall and / or the circuit in the printed circuit board.

Description

technical field [0001] The invention relates to a processing method of a circuit board, in particular to a processing method of a multilayer printed circuit board. Background technique [0002] With the development of science and technology, people have higher and higher requirements for the integration of integrated circuit boards. In order to meet such requirements, multi-layer printed circuit boards have appeared. Multi-layer printed circuit boards usually consist of multiple sub-boards stacked together. Composition, a dielectric layer is provided between each sub-board, and a plurality of blind holes and a plurality of insertion holes are usually opened on the multilayer printed circuit board, wherein the blind holes are mainly used to realize surface layer wiring and inner layer wiring. Connection, the insertion hole is used to realize the connection with electronic components, and the blind hole and insertion hole technology make the manufacture of highly integrated pr...

AI Technical Summary

Problems solved by technology

[0003] The traditional multi-layer printed circuit board processing method firstly laminates multiple sub-boards into one body, then uses laser drilling or mechanical drilling to drill holes on the printed circuit board, and then sinks the holes. Copper, electroplating, and graphic production processes. Although the process of this processing method is relatively simple, due to the process of sinking copper or / and electroplating, the electroplating solution will enter from the blind hole or / and insertion hole at the bottom of the circuit board. In the multi-layer printed circuit board, and then accumulate in the printed circuit board, cause corrosion to the hole wall and / or the circuit in the printed circuit board, and then affect the electrical performance of the printed circuit board, and thus generate a large amount of waste in the production process In order to avoid this phenomenon, in the traditional printed circuit board processing technology, resin is usually filled in the blind hole or the insertion hole during electroplating. Although this method can prevent the plating solution from the blind hole or / or The hole wall and / or the circuit in the printed circuit board will be corroded when the hole and the insertion hole enter the multilayer printed circuit board. The board is damaged; for this reason, it is necessary to improve the processing method of the traditional multilayer printed circuit board

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