Method capable of improving adhesive force of mask film of micropore-connected silk-screen printing plate

Abstract

The invention discloses method capable of improving the adhesive force of a mask film of a micropore-connected silk-screen printing plate, comprising the steps of exposing and developing. The method is characterized of comprising the steps of: respectively exposing the mask film in the process of manufacturing the silk-screen printing plate, wherein the first exposure is 110-130 seconds under a UV lamp of 3000 watt and the second exposure is 110-130 seconds after drying; and putting the silk screen into an oven under 50-60 DEG C after the first exposure and baking for 6-12 seconds. Points on the mask film are firstly exposed, baked and secondly exposed, the method can lead the 1840 points on the mask film to be stably adhered to the silk screen, prevents from the phenomena of raising and falling in the process of printing, can strictly guarantee the size of the points on the mask film, completely meets the requirement of technology quality, has high printing precision, improves the product qualified rate, and meets the use requirement.

Description

Technical field [0001] The invention relates to a thick film circuit screen printing process, in particular to a method for improving the adhesion of a microporous connection screen printing screen mask. Background technique [0002] With the continuous improvement of the integration of electronic products, thick film circuit printing technology has also been developed rapidly. For multilayer wiring, especially the fine line and microvia connection technology (line width / spacing) commonly used in multi-chip modules (MCM) (Below 0.125mm) has become an indispensable means of thick film printing, and the production of screen printing screens is the key to its technology. The outstanding advantage of the fine line and micro-hole technology is that it can greatly increase the printing density of the circuit, reduce the product volume, and promote the miniaturization of the product. Due to the unsatisfactory precision of the screen printing screen and the unsatisfactory adhesion of th...

AI Technical Summary

Problems solved by technology

If a small dot of the mask falls off during the printing process, it is not easy to find, and it will easily lead to the failure of the entire printed circuit

In the production of screen plates, the longer the exposure time, the stronger the bond between the mask and the screen, but the resolution of the printed graphics is not good; on the contrary, the shorter the exposure time, the poorer the bond between the mask and the screen

In addition, the size of the small dots on the screen mask will be reduced after light diffraction, which cannot strictly guarantee the size required by the process, and the pass rate is low