Thermosetting phenolic resin cured and foamed rapidly at normal temperature, preparation method and application thereof

Abstract

The invention discloses a thermosetting phenolic resin cured and foamed rapidly at normal temperature, a preparation method and application thereof, belonging to the technical filed of high polymer materials. The method of the invention comprises the following steps: carrying out condensation reaction on phenol and formaldehyde, and then adding urea and glycol to improve the performance of resin, such as stability, hydrophilcity and foaming effect. The phenolic resin provided by the invention has the characteristics of low content of phenol and aldehyde, greatly improved environment protection performance, no residual free phenol and aldehyde after curing, high activity and stable storage and the like; the phenolic resin can be used as a plugging material, and can be rapidly cured not only under normal temperature of 20-25 DEG C but also under low temperature of 10-15 DEG C, thereby being applied to various fields such as engineering plugging and the like.

Description

technical field [0001] The invention relates to the field of macromolecular materials, and relates to a phenolic resin and its curing system that rapidly foams, expands and solidifies at normal temperature, and is mainly used for engineering plugging and the like. Background technique [0002] Phenolic resin is formed by polycondensation of phenolic compounds and aldehyde compounds under the action of a catalyst. The polycondensation reaction of thermosetting phenolic resin is generally carried out under the action of basic catalysts such as sodium hydroxide, ammonia water, barium hydroxide, calcium hydroxide, magnesium hydroxide, sodium carbonate, tertiary amine, etc. Phenolic resin, when used in the field of building structure to form a curing system, has many shortcomings such as long curing time, a lot of condensation water produced by the reaction in the curing stage, must be cured at high temperature and high pressure, and the molding process is complicated, which seri...

AI Technical Summary

Problems solved by technology

The polycondensation reaction of thermosetting phenolic resin is generally carried out under the action of basic catalysts such as sodium hydroxide, ammonia water, barium hydroxide, calcium hydroxide, magnesium hydroxide, sodium carbonate, tertiary amine, etc. Phenolic resin, when used in the field of building structure to form a curing system, has many shortcomings such as long curing time, a lot of condensation water produced by the reaction in the curing stage, must be cured at high temperature and high pressure, and the molding process is complicated, which seriously limits the application of phenolic resin in the field of building structure. application

[0003] On the other hand, the free aldehyde of traditional water-soluble phenolic resin is 4%-7%, and the free phenol is more than 2%, which leads to poor environmental protection, long curing time and high molding temperature. These factors have a certain impact on its application.

And the commonly used phenolic resin curing temperature is generally above 100 ° C, it is not suitable for normal temperature operation in use

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