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Heat radiating method for circuit board

A heat dissipation method and circuit board technology, which are applied in the directions of printed circuits connected with non-printed electrical components, cooling/ventilation/heating transformation, etc., can solve the height of limited power devices, the limitation of circuit board component thickness, and the impossibility of height Great improvement and other problems, to achieve the effect of flexible arrangement, good heat dissipation effect, and lower height

Inactive Publication Date: 2010-06-02
SICHUAN COC DISPLAY DEVICES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] like figure 2 As shown, due to the limitation of the height of the power device itself, the height of the vertical plug-in radiator cannot be greatly improved, so the thickness of the circuit board assembly is correspondingly limited

Method used

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  • Heat radiating method for circuit board
  • Heat radiating method for circuit board
  • Heat radiating method for circuit board

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Embodiment Construction

[0022] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention can be implemented in many different ways defined and covered by the claims. The same components are denoted by the same reference numerals in the drawings.

[0023] like image 3 As shown, it is a radiator installation method according to a preferred embodiment of the present invention. like image 3 As shown, the pins of the semiconductor power device 1 are bent at right angles to the direction of the PCB printed circuit board 5 according to the installation method. Place the power device 1 horizontally on the circuit board 5, with the side on which the heat sink 3 is mounted upward, and insert the pin 12 bent at a right angle into the circuit board 5, and then assemble the heat sink 3 corresponding to the corresponding mounting holes , wherein an insulating thermal pad 7 is provided between the power device 1 and the hea...

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Abstract

The invention discloses a heat radiating method for a circuit board, which comprises the steps of: bending and forming the pins of a power device into a right angle; horizontally arranging the power device of which the pins are bent and formed into the right angle on the circuit board to enable the pins to be inserted into the circuit board; and connecting a heat radiator with the circuit board, wherein the power device is arranged between the heat radiator and the circuit board. The method can effectively fix the power device, thereby ensuring that the heat radiating area can not lose; and meanwhile, the whole circuit board is lowered for a height which is nearly equal to the height of the whole power device, thereby effectively achieving the purpose of lowering the height of the whole circuit board.

Description

technical field [0001] The present invention relates to the heat dissipation method that is used for all kinds of circuit board assemblies that have strict requirements on thickness, more specifically, relates to the heat dissipation method that is used for various flat panel products (for example, each module circuit board of liquid crystal television LCD and plasma television PDP) cooling method. Background technique [0002] A color plasma display (PDP, plasma display panel) is a display device that has developed rapidly in recent years. Color plasma display has become the first choice for large-screen display devices due to its superior performance. At present, large-screen color plasma display devices have begun to enter the market, especially the AC-type AC-PDP has been extensively researched and applied due to its simple driving method and other advantages. And it will gradually become popular in recent years. [0003] The drive circuit plays an important role in th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K1/18
Inventor 班卫国
Owner SICHUAN COC DISPLAY DEVICES
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