Unlock instant, AI-driven research and patent intelligence for your innovation.
Manufacturing method of circuit board fine line
What is Al technical title?
Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A manufacturing method and thin circuit technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve the problems that cannot meet the requirements of circuit board thin circuit
Active Publication Date: 2011-09-07
UNIMICRON TECH CORP
View PDF0 Cites 2 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
[0005] The above-mentioned manufacturing method of the thin circuit board of the known circuit board uses a semi-additive method or a subtractive method to form second-order blind holes to make the plurality of thin circuits, which cannot meet the requirements of the thin circuit board.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Image
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
Smart Image
Examples
Experimental program
Comparison scheme
Effect test
no. 1 example
[0033] An embodiment of the present invention provides a method for manufacturing thin circuits on a circuit board, including the following steps:
[0034] Please refer to Figure 2A , a substrate 300 is provided, the top surface of the substrate 300 has a first conductive layer 310 , and the bottom surface of the substrate 300 has a second conductive layer 320 .
[0035] The steps of forming the first conductive layer 310 and the second conductive layer 320 are performed by one of sputtering, evaporation, electroplating and chemical deposition (CVD). Wherein, the first conductive layer 310 and the second conductive layer 320 include one of tin (Sn), copper (Cu), chromium (Cr), palladium (Pd), nickel (Ni) and alloys thereof. In this embodiment, the step of forming the first conductive layer 310 and the second conductive layer 320 is performed by electroplating, and the first conductive layer 310 and the second conductive layer 320 are copper.
[0036] Please refer to Figur...
no. 2 example
[0046] An embodiment of the present invention provides another method for manufacturing thin circuits on a circuit board, which includes the following steps:
[0047] Please refer to Figure 3A , a substrate 500 is provided, the top surface of the substrate 500 has a first conductive layer 510 , and the bottom surface of the substrate 500 has a second conductive layer 520 .
[0048] In this embodiment, the step of forming the first conductive layer 510 is performed by chemical deposition, and the first conductive layer 510 is copper, and the step of forming the second conductive layer 520 is performed by chemical deposition, and the second conductive layer 520 is copper.
[0049] Please refer to Figure 3B , the patterned first conductive layer 510 is used to form a patterned first conductive layer 510 a, and the patterned first conductive layer 510 a has a first conductive layer opening 512 .
[0050] Please refer to Figure 3C , performing laser drilling at the opening 5...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
PUM
Login to View More
Abstract
The invention relates to a manufacturing method of circuit board fine lines, which comprises the following steps of: providing a baseplate, wherein the top surface of the baseplate is provided with a first conducting layer, and the bottom surface of the baseplate is provided with a second conducting layer; figuring the first conducting layer to enable the first conducting layer to be provided with at least one opening; carrying out laser drilling at the at least one opening of the first conducting layer and penetrating through the baseplate, thereby forming at least one blind hole; removing the figured first conducting layer, and figuring the second conducting layer to form at least one conductive pad below the blind hole; forming a coppersmelting layer through a coppersmelting process,wherein the coppersmelting layer is covered on the surface of the figured baseplate and the blind hole; forming a figured photoresist layer on the surface of the copper smelting layer; electroplating to form a figured third conducting layer for forming a plurality of fine lines; and removing the photoresist layer on the baseplate. The manufacturing method can be used for manufacturing the fine lines.
Description
technical field [0001] The invention relates to a method for manufacturing a circuit board, in particular to a method for manufacturing thin lines of the circuit board. Background technique [0002] With the rapid development of the communication industry, information electronics technology has been moving towards the integration goal of consumerelectronics (Computer, Communication, ConsumerElectronics, 3C) since the 1990s. Personalized electronic products are constantly being introduced, emphasizing portability The convenience of multimedia and high-quality information communication tools has driven the semiconductor industry, especially the change in the type of semiconductor packaging. These market demands have directly contributed to the digitalization of information electronics, making semiconductor packaging naturally move toward multipin development and research and development. For the printed circuit board (Printing Circuit Board, PCB) itself, the above-mentioned...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.
Login to View More 
Login to View More